Fig. 1. DSSC fabrication process.
Fig. 3. XRD data of TiO2 layer with TTIP molar ratio (a: 0.1 mol, b: 0.3 mol, c: 0.5 mol, d: 0.7 mol, and e: 0.9 mol).
Fig. 2. The surface of TiO2 layer with TTIP molar ratio.
Fig. 4. I-V Curve by addition of diffenrent TTIP in TiO2 paste.
Table 1. The molar ratio of TTIP used in TiO2 paste.
Table 2. Electrical properties and efficiency by different additive amount of TTIP in TiO2 paste.
참고문헌
- B. O'Regan and M. Gratzel, Nature, 353, 737 (1991). [DOI: https://doi.org/10.1038/353737a0]
- L. M. Peter, Phys. Chem. Chem. Phys., 9, 2630 (2007). [DOI: https://doi.org/10.1039/b617073k]
- T. W. Hamann, R. A. Jensen, A.B.F. Martinson, H. V. Ryswyk, and J. T. Hupp, Energy Environ. Sci., 1, 66 (2008). [DOI: https://doi.org/10.1039/b809672d]
- M.K.I. Senevirathna, P.K.D.D.P. Pitigala, E.V.A. Premalal, K. Tennakone, G.R.A. Kumara, and A. Konno, Sol. Energy Mater. Sol. Cells, 91, 544 (2007). [DOI: https://doi.org/10.1016/j.solmat.2006.11.008]
- S. Y. Kwon, W. Yang, and Z. Y. Zhou, J. Korean Inst. Electr. Electron. Mater. Eng., 27, 115 (2014). [DOI: https://doi.org/10.4313/JKEM.2014.27.2.115]
- S. Y. Kwon, W. Yang, and Z. H. Zhang, J. Korean Inst. Electr. Electron. Mater. Eng., 27, 746 (2014). [DOI: https://doi.org/10.4313/JKEM.2014.27.11.746]
- H. J. Koo, J. Park, B. Yoo, K. Yoo, K. Kim, and N. G. Park, Inorg. Chim. Acta, 361, 677 (2008). [DOI: https://doi.org/10.1016/j.ica.2007.05.017]
- H. S. Park. S. Y. Kwon, and W. Yang, J. Korean Inst. Electr. Electron. Mater. Eng., 25, 537 (2012). [DOI: https://doi.org/10.4313/JKEM.2012.25.7.537]
- T. Miyasaka and Y. Kijitori, J. Electrochem. Soc., 151, A1767 (2004). [DOI: https://doi.org/10.1149/1.1796931]
- A. J. Medford, M. R. Lilliedal, M. Jorgensen, D. Aaro, H. Pakalski, J. Fyenbo, and F. C. Krebs, Opt. Express, 18, A272 (2010). [DOI: https://doi.org/10.1364/OE.18.00A272]
- F. C. Krebs, S. A. Gevorgyan, and J. Alstrup, J. Mater. Chem., 19, 5442 (2009). [DOI: https://doi.org/10.1039/b823001c]
- D. Vorkapic and T. Matsoukas, J. Am. Ceram. Soc., 81, 2815 (1998). [DOI: https://doi.org/10.1111/j.1151-2916.1998.tb02701.x]
- Y. R. Jung, J. Y. Park, and H. B. Gu, Mater. Lett., 138, 268 (2015). [DOI: https://doi.org/10.1016/j.matlet.2014.09.135]