Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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CrC Interlayer Effect on Tribological Properties of Amorphous Carbon Deposited by UBMS Method

비대칭 마그네트론 스퍼터로 증착된 비정질 탄소박막의 트라이볼로지 특성에서 CrC 삽입층 효과에 대한 연구

  • Kim, Phil Jung (Department of Electronics, Chosun College of Science and Technology) ;
  • Park, Yong Seob (Department of Electronics, Chosun College of Science and Technology)
  • 김필중 (조선이공대학교 전자과) ;
  • 박용섭 (조선이공대학교 전자과)
  • Received : 2018.07.30
  • Accepted : 2018.08.23
  • Published : 2018.11.01
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Abstract

We investigated the tribological properties of amorphous carbon (a-C) films deposited with CrC interlayers of various thicknesses as the adhesive layer. A-C and CrC thin films were deposited using the unbalanced magnetron (UBM) sputtering method with graphite and chromium as the targets. CrC films as the interlayer were fabricated under a-C films, and various structural, surface, and tribological properties of a-C films deposited with various CrC interlayer thicknesses were investigated. With various CrC interlayer thicknesses under a-C films, the tribological properties of CrC/a-C films were improved; the increased film thickness exhibited a maximum high hardness of over 27.5 GPa, high elastic modulus of over 242 GPa, critical load of 31 N, residual stress of 1.85 GPa, and a smooth surface below 0.09 nm at the condition of 30-nm CrC thickness.

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References

  1. B. Krzan, F. Novotny-Farkas, and Joze Vizintin, Tribol. Int., 42, 229 (2009). [DOI: https://doi.org/10.1016/j.triboint.2008.06.011]
  2. J. Robertson, Mater. Sci. Eng., 37, 129 (2002). [DOI: https://doi.org/10.1016/S0927-796X(02)00005-0]
  3. P. K. Bachmann, H. Lade, D. Leers, D. U. Wiechert, and G.S.A.M. Theunissen, Diamond Relat. Mater., 3, 799 (1994). [DOI: https://doi.org/10.1016/0925-9635(94)90272-0]
  4. N. Sasvvides and T. J. Bell, Appl. Phys. Lett., 46, 146 (1985). https://doi.org/10.1063/1.95715
  5. C. Donnet, Surf. Coat. Technol., 80, 151 (1996). [DOI: https://doi.org/10.1016/0257-8972(95)02702-5]
  6. C. P. Klages and R. Memming, Mater. Sci. Forum, 52, 609 (1989). [DOI: https://doi.org/10.4028/www.scientific.net/MSF.52-53.609]
  7. K. Bewilogua, C. V. Cooper, C. Specht, J. Schroder, R. Wittorf, and M. Grischke, Surf. Coat. Technol., 127, 224 (2000). [DOI: https://doi.org/10.1016/S0257-8972(00)00666-6]
  8. A. A. Voevodin, C. Rebholz, J. M. Schneider, P. Stevenson, and A. Matthews, Surf. Coat. Technol., 73, 185 (1995). [DOI: https://doi.org/10.1016/0257-8972(94)02381-6]
  9. D. P. Monaghan, D. G. Teer, P. A. Logan, I. Efeoglu, and R. D. Arnell, Surf. Coat. Technol., 60, 525 (1993). [DOI: https://doi.org/10.1016/0257-8972(93)90146-F]
  10. Y. S. Park, B. Y. Hong, S. J. Cho, and J. H. Boo, Bull. Korean Chem. Soc., 32, 939 (2011). [DOI: https://doi.org/10.5012/bkcs.2011.32.3.939]
  11. C. Casiraghi, A. C. Ferrari, and J. Robertson, Phys. Rev. B, 72, 085401 (2005). [DOI: https://doi.org/10.1103/PhysRevB.72.085401]
  12. Y. Y. Chang, D. Y. Wang, and W. T. Wu, Thin Solid Films, 420, 241 (2002). [DOI: https://doi.org/10.1016/S0040-6090(02)00801-5]
  13. C. Corbella, E. Bertran, M. C. Polo, E. Pascual, and J. L. Andujar, Diamond Relat. Mater., 16, 1828 (2007). [DOI: https://doi.org/10.1016/j.diamond.2007.07.012]
  14. A. Anders, Phys. Rev. E, 55, 969 (1997). [DOI: https://doi.org/10.1103/PhysRevE.55.969]
  15. J. Robertson, Diamond Relat. Mater., 3, 361 (1994). [DOI: https://doi.org/10.1016/0925-9635(94)90186-4]
  16. A. A. Voevodin, M. A. Capano, S.J.P. Laube, M. S. Donley, and J. S. Zabinski, Thin Solid Films, 298, 107 (1998). [DOI: https://doi.org/10.1016/S0040-6090(96)09145-6]
  17. D. Beeman, J. Silverman, R. Lynds, and M. R. Anderson, Phys. Rev. B, 5, 4951 (1972). https://doi.org/10.1103/PhysRevB.5.4951
  18. V. Kulikovsky, P. Bohac, F. Franc, A. Deineka, V. Vorlicek, and L. Jastrabik, Diamond Relat. Mater., 10, 1076 (2001). [DOI: https://doi.org/10.1016/S0925-9635(00) 00525-2]
  19. N. Popovic, Z. Bogdanov, B. Goncic, S. Zec, Z. Rakocevic, M. Zlatanovic, and D. Perusko, Thin Solid Films, 459, 286 (2004). [DOI: https://doi.org/10.1016/j.tsf.2003.12.130]
  20. J. Bulir, M. Novotny, M. Jelinek, T. Kocourek, and V. Studnicka, Surf. Coat. Technol., 200, 708 (2005). [DOI: https://doi.org/10.1016/j.surfcoat.2005.01.087]
  21. K. Yamamoto and K. Matsukado, Tribol. Int., 39, 1609 (2006). [DOI: https://doi.org/10.1016/j.triboint.2006.01.004]
  22. C. Liu, G. Q. Li, W. Gou, Z. X. Mu, and C. W. Zhang, Chin. Phys. Lett., 21, 2249 (2004). [DOI: https://doi.org/10.1088/0256-307X/21/11/048]
  23. C. Weissmantel, Thin Solid Films, 92, 55 (1982). [DOI: https://doi.org/10.1016/0040-6090(82)90187-0]
  24. D. Sheeja, B. K. Tay, C. Q. Sun, and Y. Q. Fu, J. Mater. Sci. Technol., 38, 421 (2003). [DOI: https://doi.org/10.1023/A:1021807312324]
  25. K. Bewilogua, R. Wittorf, H. Thomsen, and M. Weber, Thin Solid Films, 447, 142 (2004). [DOI: https://doi.org/10.1016/S0040-6090(03)01088-5]
  26. Y. T. Pei, D. Galvan, and J.Th.M. De Hosson, Acta Mater., 53, 4505 (2005). [DOI: https://doi.org/10.1016/j.actamat.2005.05.045]
  27. B. Yang, Z. H. Huang, C. S. Liu, Z. Y. Zeng, X. J. Fan, and D. J. Fu, Surf. Coat. Technol., 200, 5812 (2006). [DOI: https://doi.org/10.1016/j.surfcoat.2005.08.150]
  28. S. Meskinis, M. Andrulevicius, S. Tamulevicius, V. Kopustinskas, K. Slapikas, J. Jankauskas, and B. Ciziute, Vacuum, 80, 1007 (2006). [DOI: https://doi.org/10.1016/j.vacuum.2006.01.008]