Journal of IKEEE (전기전자학회논문지)

Institute of Korean Electrical and Electronics Engineers (한국전기전자학회)
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FPGA implementation of high temperature feature points extraction algorithm for thermal image

열화상 이미지에 대한 고온 특징점 추출 알고리즘의 FPGA 구현

  • Ko, Byoung-Hwan (Dept. of Electronics Engineering, CheongJu University) ;
  • Kim, Hi-Seok (Dept. of Electronics Engineering, CheongJu University)
  • Received : 2018.08.14
  • Accepted : 2018.09.05
  • Published : 2018.09.30
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Abstract

Image segmentation has been presented in the various method in image interpretation and recognition, and the image is using separate the characteristics of the specific purpose. In this paper, we proposed an algorithm that separate image for feature points detected to high temperature in a Thermal infrared image. In order to improve the processing time, the proposed algorithm is implemented to FPGA Hardware Block using the Zynq-7000 Evaluation Board environment. The proposed High-Temperature Detection Algorithm and total FPGA blocks show a decrease of a processing time result from 16ms to 0.001ms, and from 50ms to 0.322ms respectively. It is also verified similar results of the PSNR to comparing software thermal testbench and hardware ones.

이미지 분할은 영상의 해석과 이미지 인식 분야에서 다양한 방법으로 연구되고 있으며, 특정한 목적에 따른 이미지의 특성을 분리하기 위해 사용된다. 본 논문에서는 열화상 이미지의 특징점인 고온을 검출하여 이미지를 분할하는 알고리즘을 제안한다. 또한 연산속도의 향상을 위해 제안하는 알고리즘을 Zynq-7000 Evaluation Board 환경에서 FPGA Hardware Block Design을 진행하였다. 고온 검출 알고리즘은 16ms에서 0.001ms의 속도 향상을 보였으며 전체 블록은 50ms에서 0.322ms로 속도 향상을 보이는 것을 확인하였다. 또한 영상 테스트벤치를 사용하여 소프트웨어와 하드웨어 이미지에 대해 유사한 PSNR 결과를 입증하였다.

Keywords

References

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