DOI QR코드

DOI QR Code

Characterization of Electro-deposited Ni-P Layer by Using Dynamic Nano-Indentation Method

동적 나노압침법을 이용한 Ni-P 도막의 특성 연구

  • Jung, Moo Young (Department of Materials Science and Engineering, Dankook University) ;
  • Baik, Youl (Department of Materials Science and Engineering, Dankook University) ;
  • Kang, Bo Kyeong (Department of Materials Science and Engineering, Dankook University) ;
  • Choi, Yong (Department of Materials Science and Engineering, Dankook University) ;
  • Kwon, Hyuk Joo (R&D Center, HANSCO)
  • 정무영 (단국대학교 신소재공학과) ;
  • 백열 (단국대학교 신소재공학과) ;
  • 강보경 (단국대학교 신소재공학과) ;
  • 최용 (단국대학교 신소재공학과) ;
  • 권혁주 (한스코 연구개발부)
  • Received : 2018.06.07
  • Accepted : 2018.08.09
  • Published : 2018.08.31

Abstract

Dynamic nano-indentation method was applied to characterize thin electroformed Ni-P layers. The Ni-P layers were produced in a sulphamic acid bath at $50^{\circ}C$ in $0.02A/cm^2$ for 10-60 minutes. The chemical analyses by XRD and EDX showed that the Ni-P layers were very fine grains with mainly $Ni_3P$ with Ni. The surface roughness determined by atomic force microscopy increased with thickness, which was relative to the surface morphology. The nano-hardness and the stiffness of the thin Ni-P layers with thickness of 1.9, 6.2 and $7.5{\mu}m$ were 5.52, 6.52 and 6.77 [GPa] and 56.7, 76.2 and 108.0 [${\mu}N/nm$], respectively. The elastic modulus of the Ni-P layer increased with thickness such as 37.29, 54.50 and 78.76 [GPa], respectively. The surface roughness of the electroplated Ni-P layers with diverse thickness was 8.66, 18.56 and 35.22 [nm], respectively. The enhanced nano-mechanical properties were related to mainly residual stress of the Ni-P layers.

Keywords

References

  1. H.B. Lee, D.S. Wuu, C.Y. Lee, C.S. Lin, Wear and Immersion Corrosion of Ni-P Electrodeposit in NaCl Solution, Tribology International, 43 (2010) 235-244. https://doi.org/10.1016/j.triboint.2009.05.031
  2. Myung-Hee Choi, Young Bae Park, Byong ho Rhee, Eungsun Byon, Kyu Hwan Lee, Effect of Heat Treatment on Interface Behavior in Ni-P/Cr Double Layer, Journal of the Korean Institute of Surface Engineering, 48 (2015) 260-264. https://doi.org/10.5695/JKISE.2015.48.6.260
  3. Amir Ahmadi Ashtiani, Soheila Faraji, Sepideh Amjad Iranagh, Amir Hossein Faraji, The Study of Electroless Ni-P with Different Complexing Agents on Ck45 Steel Substrate, Arabian Journal of Chemistry, 10 (2017) 1541-1545. https://doi.org/10.1016/j.arabjc.2013.05.015
  4. P. Peeters, G.v.d. Hoorn, T. Daenen, A. Kurowski, G. Staikov, Properties of Electroless and Electroplated Ni-P and its Application in Microgalvanics, Electrochimica Acta, 47 (2001) 161-169. https://doi.org/10.1016/S0013-4686(01)00546-1
  5. Kazimierz Czapczyk, Piotr Siwak, Piotr Jablonski, Luksz Furmanski, Pawel Grobelny, Stanislaw Legutko, Influence of the Thickness of Ni-P Coating Applied on 7075 Aluminum Alloy on its Hardness, Advances in Science and Technology, 10 (2016) 53-58.
  6. Cheng-Hsun Hsu, Sheng-Chien Chiu, Yih-Hsun Shih, Effects of Thickness of Electroless Ni-P Deposit on Corrosion Fatigue Damage of 7075-T6 under Salt Spray Atmosphere, 45 (2004) 3201- 3208.
  7. Moo Hong Seo, Dong Jin Kim, Joung Soo Kim, The Study on Residual Stresses of Ni Alloy Electrodeposits for Steam Generator Tube Repair, Proceedings of the Korean Nuclear Society Autumn Meeting, 35 (2003).
  8. G. Mcmahon, U. Erb, Structural Transitions in Electroplated Ni-P alloys, Journal of Materials Science Letters, 8 (1989) 865-868. https://doi.org/10.1007/BF01730163
  9. Raj Narayan, M.N. Mungole, Electrodeposition of Ni-P Alloy Coatings, Surface Technology, 24 (1985) 233-239. https://doi.org/10.1016/0376-4583(85)90073-1
  10. A.P. Ordine, S.L. Diaz, I.C.P. Margarit, O.E. Barcia, O.R. Mattos, Electrochemical Study on Ni-P Electrodeposition, Electrochimica Acta, 51 (2006) 1480-1486. https://doi.org/10.1016/j.electacta.2005.02.129
  11. R. Rofagha, U.Erb, D.Ostrander, G. Palumbo, K.T. Aust, The Effects of Grain Size and Phosphorus on the Corrosion of Nanocrystalline Ni-P Alloys, Nanostructured Materials, 2 (1993) 1-10. https://doi.org/10.1016/0965-9773(93)90044-C
  12. N. Du M. Pritzker, Investigation of electroless plating of Ni-W-P alloy films, Journal of Applied Electrochemistry, 33 (2003) 1001-1009. https://doi.org/10.1023/A:1026231532006