Micro LED의 전사 기술

Transfer technology of Micro LED

  • 전인학 (고려대학교 공학대학원 전기전자컴퓨터공학과) ;
  • 유재수 (중앙대학교 화학신소재공학부) ;
  • 주병권 (고려대학교 전기전자공학부)
  • 발행 : 2018.12.31

초록

차세대 디스플레이로 부상하고 있는 Micro LED는 현재까지 여러 기술적인 문제로 상용화가 어려운 상황이다. 특히 Micro 단위로 작은 LED를 디스플레이 기판으로 옮기는 전사(Transfer) 기술이 상용화를 가지고 올 수 있는 핵심 기술이며, 중요한 변수다. 전사기술의 핵심은 LED를 원하는 위치에 빠르고 정확하게 이동시키는 것에 있다. 따라서 Micro LED에서 가장 핵심 과제인 전사 기술에 대해 고민할 필요가 있으며, 전사 기술 중 하나인 Elastomer Stamp를 이용한 전사 기술에 대해서 분석해보고 정리해보았다.

Micro LED, which is emerging as a next generation display, is difficult to commercialize due to various technical problems to date. In particular, transfer technology that transfers small LED to a display substrate in micro units is a key technology that can bring commercialization and is an important variable. The core of transfer technology is to move the LED quickly and accurately to the desired location. Therefore, it is necessary to pay attention on the transfer technology which is the most important task of Micro LED, and we analyzed and summarized the transfer technology using Elastomer Stamp which is one of the advanced transfer technologies.

키워드

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