Journal of Adhesion and Interface (접착 및 계면)

The Society of Adhesion and Interface, Korea (한국접착및계면학회)
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A review on electrically debonding Adhesives

전기해체 접착제

  • Received : 2018.06.08
  • Accepted : 2018.06.13
  • Published : 2018.06.29
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Abstract

Electrically debonding adhesives[EDA], one of the controlled delamination materials[CDM] is reviewed. CDM can be defined as the ability to separate adhesive bonded assemblies without causing damage to the substrates. Its application includes electronics, medical surgery, dentistry, building and general manufacturing where the opportunity to separate assemblies is important. There are several important mechanisms of EDAs; faradaic reaction, phase separation and anode detachment, cathodic debonding, gas emission mechanism, and mechanical stresses. These mechanisms are reviewed with various research results. Since the mechanism behind the electrochemical debonding of adhesives is not well understood, this review aims to help the research scientists in the industries. Finally, new applications of EDA are introduced as new business opportunity.

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References

  1. B. A. Hutchinson, Y. Liu & Y. Lu, The Journal of Adhesion, 93, 10, (2016).
  2. S. Porada et al., Progress in Materials Science, 58, 8, (2013).
  3. M. D. Gilbert, US Patent 2008/0196828A1, (2008).
  4. J. Welsh, Structural Dynamics, and Materials Conference, 7-10, (2003).
  5. Y. Lu, J. Broughton, P. Winfield, International Journal of Adhesion and Adhesives, 50, (2014).
  6. H. Shiote, C. Sato, M. Ohe, J Adhes Soc Japan, 45, 10 (2009). https://doi.org/10.11618/adhesion.45.10
  7. J. S. Berg, et al., US Patent US9371669B2, (2016).
  8. R. McCurdy, Ph D Thesis:, Oxford Brookes University, (2011).
  9. D. Haydon, Assem Autom, 22, 4, (2002).
  10. D. E. Packham, Handbook of Adhesion Second Edition. (2005).
  11. S. O. Dorst, US Patent US Pat. No. 2,765,267., (1956).
  12. EMEC consultants, US Patent No. 5,507,926, (1996).
  13. B. WH, Jackson DR., Transp Res Rec, (2001).
  14. Leijonmarck, S., et al., International Journal of Adhesion and Adhesives, 32, 39, (2012). https://doi.org/10.1016/j.ijadhadh.2011.09.003
  15. S. Leijonmarck, Ph D thesis:, Kungliga Tekniska Hogskolan, Stockholm, (2013).
  16. WO2010146144A3, JP2012530173A, (2007).
  17. WO2005028583A1, (2003).
  18. W. J. van Ooij, A. Sabata, D. Loison, T. Jossic, and T. C. Charbonnier, J. Adhes. Sci. Technol., 3, 1, (1989).
  19. Leijonmarck, S., et al., Journal of the Electrochemical Society, 158, 109 (2011). https://doi.org/10.1149/1.3622657
  20. http://www.eiclabs.com/index.htm 111 Downey St., Norwood, MA 02062 Tel. (781)769-9450; Fax (781)551-0283.
  21. M. D. Gilbert, US Patent: 6620308, (2006).
  22. H. Shiote, Y. Sekiguchi, M. Ohe, and C. Sato, The Journal of Adhesion, 93, 10, (2017).
  23. M. D. Gilbert, US Patent: 20070269659, (2007).
  24. P. Norberg, T. Remonen, X. Wang, M. Sandberg, WO2008150227 A1, (2007).
  25. Henkel Ag, WO2017133864A1, EP3199344A1, (2016).
  26. The Yokohama Rubber Co., Ltd., EP1914285A1, (2005).
  27. H. K. Gatty, S. Schroder, F. Niklaus, N. Roxhed and G. Stemme, J. Solid State Sci. Technol., 3, 5, (2014).
  28. H. Stockman (Air Materiel Command, Cambridge Field Station, Cambridge 39, Mass.).
  29. O. K. Ban, A. C. Spielberg, US Patent: US7430398-B2, (2005).
  30. J. Gao, Z. Pang, Q. Chen, L. R. Zheng, IEEE RFID, (2010).
  31. Kajimoto, Noboru, スマートに剝離可能な新規齒科用セメントの開發, (2015).
  32. 梶本昇, 宇山惠美, 關根一光, 浜田賢一, 日本齒科理工學會近畿中四國地方會夏期セミナー, 大阪, (2015).