한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제31권4호
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  • Pages.249-254
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  • 2018
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  • 1226-7945(pISSN)
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  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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고온열전모듈용 금속유리계 페이스트 연구

Research for Solder Paste in Metallic Glass System for Thermoelectric Modules

  • 서승호 (한국기술교육대학교 에너지신소재공학과) ;
  • 손근식 (한국기술교육대학교 에너지신소재공학과) ;
  • 서강현 (한국기술교육대학교 에너지신소재공학과) ;
  • 최순목 (한국기술교육대학교 에너지신소재공학과)
  • Seo, Seung-Ho (School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education) ;
  • Son, Geun Sik (School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education) ;
  • Seo, Kang Hyun (School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education) ;
  • Choi, Soon-Mok (School of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
  • 투고 : 2017.09.06
  • 심사 : 2018.02.05
  • 발행 : 2018.05.01
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초록

We researched about a bulk metallic glass system as an additive to an Ag paste for high temperature thermoelectric modules. Bulk metallic glass (BMG) ribbons were produced by using a rapid solidification process (RSP) under a cooling rate condition higher than $10^{\circ}C/sec$. We investigated BMG characteristics of the ribbons by means of x-ray diffraction (XRD) and differential scanning calorimetry (DSC) in order to evaluate the glass transition temperature ($T_g$) and the recrystallization temperature ($T_x$) lower than $400^{\circ}C$. A milling process was also developed to apply the BMG ribbons to a commercial Al paste as an additive for lower sintering temperature.

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