Applied Science and Convergence Technology

한국진공학회 (The Korean Vacuum Society)
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Flexible Plasma Sheets

  • Cho, Guangsup (Department of Electrical and Biological Physics, Kwangwoon University) ;
  • Kim, Yunjung (Department of Electrical and Biological Physics, Kwangwoon University)
  • 투고 : 2017.11.25
  • 심사 : 2018.04.03
  • 발행 : 2018.03.31
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초록

With respect to the electrode structure and the discharge characteristics, the atmospheric pressure plasma sheet of a thin polyimide film is introduced in this study; here, the flexible plasma device of a dielectric-barrier discharge with the ground electrode and the high-voltage electrode formulated on each surface of a polyimide film whose thickness is approximately $100{\mu}m$, that is operated with a sinusoidal voltage at a frequency of 25 kHz and a low voltage from 1 kV to 2 kV is used. The streamer discharge is appeared along the cross-sectional boundary line between two electrodes at the ignition stage, and the plasma is diffused on the dielectric-layer surface over the high-voltage electrode. In the development of a plasma sheet with thin dielectric films, the avoidance of the insulation breakdown and the reduction of the leakage current have a direct influence on the low-voltage operation.

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참고문헌

  1. G. Fridman, G. Friedman, A. Gutsol, A. B. Shekhter, V. N. Vasilets, and A. Fridman, Plasma Process. Polym. 5, 503 (2008).
  2. K. Foster, R. Moy, and E. Fincher, J. Cosmet. Dermatol. 7, 169 (2008). https://doi.org/10.1111/j.1473-2165.2008.00385.x
  3. J. Heinlin, G. Morfill, M. Landthaler, W. Stolz, G. Isbary, and J. Zimmermann, J. Dtsch. Dermatol Ges. 8, 968 (2010).
  4. R. Tiede, J. Hirschberg, G. Daeschlein, T. Woedtke, W. Vioel, and S. Emmert, Contrib. Plasma Phys. 54, 118 (2014). https://doi.org/10.1002/ctpp.201310061
  5. W. Kim, K. Woo, G. Kim, and K. Kim, J. Phys. D: Appl. Phys. 44, 013001-1 (2011). https://doi.org/10.1088/0022-3727/44/1/013001
  6. B. Park, K. Takatori, M. Lee, D. Han, Y. Woo, H. Son, J. Kim, K. Chung, S. Hyun, and J. Park, Surface & Coatings Tech. 201, 5738 (2007). https://doi.org/10.1016/j.surfcoat.2006.07.039
  7. D. Dobrynin, K. Arjunan, A. Fridman, G Friedman, and A. M. Clyne, J. Phys D: Appl. Phys. 44, 075201-1 (2011). https://doi.org/10.1088/0022-3727/44/7/075201
  8. G. Kim, W. Kim, K. Kim, and J. Lee, Appl. Phys. Lett. 96, 021502-1 (2010). https://doi.org/10.1063/1.3292206
  9. H. Uhm, E. Choi, G. Cho, and Y. Hong, J. Korean Phys. Soc. 60, 897 (2012). https://doi.org/10.3938/jkps.60.897
  10. H. Uhm, J. Kang, E. Choi, and G. Cho, J. Korean Phys. Soc. 61, 551 (2012). https://doi.org/10.3938/jkps.61.551
  11. G. Park, K. Baik, J. Kim, Y. Kim, K. Lee, R. Jung, and G. Cho, J. Korean Phys. Soc. 60, 916 (2012). https://doi.org/10.3938/jkps.60.916
  12. G. Fridman, M. Peddinghaus, H. Ayan, A. Fridman, M. Balasubramanian, A. Gutsol, A. Brooks, and G. Friedman, Plasma Chem. Plasma Process. 26, 425 (2006). https://doi.org/10.1007/s11090-006-9024-4
  13. J. Heinlin, G. Isbary, W. Stolz, G. Morfill, M. Landthaler, T. Shimizu, B. Steffes, T. Nosenko, J.L. Zimmermann, and S. Karrer, J. Eur. Acad. Dermatol. Venereol. 25, 1 (2011).
  14. K. W. Foster, R. L. Moy, and E. F. Fincher, J. Cosmet. Dermatol. 7, 169 (2008). https://doi.org/10.1111/j.1473-2165.2008.00385.x
  15. M. A. Bogle, K. A. Arndt, and J. S. Dover, Arch Dermatol. 143, 168 (2007).
  16. R. Tiede, J. Hirschberg, G. Daeschlein, T. V. Woedtke, W. Vioel, and S. Emmert, Contrib. Plasma Phys. 54, 118 (2014). https://doi.org/10.1002/ctpp.201310061
  17. J. Pan, P. Sun, Y. Tian, H. Zhou, H. Wu, N. Bai, F. Liu, W. Zhu, J. Zhang, K. H. Becker, and J. Fang, IEEE Trans. Plasma Sci. 38, 3143 (2010). https://doi.org/10.1109/TPS.2010.2066291
  18. X. Lu, Y. Cao, P. Yang, Q. Xiong, Z. Xiong, Y. Xian, and Y. Pan, IEEE Trans. Plasma Sci. 37, 1531 (2009).
  19. H. Lee, G. Kim, J. Kim, J. Park, J. Lee, and G. Kim, J. Endod. 35, 587 (2009). https://doi.org/10.1016/j.joen.2009.01.008
  20. P. Sun, J. Pan, Y. Tian, N. Bai, H. Wu, L. Wang, C. Yu, J. Zhang, W. Zhu, K. H. Becker, and J. Fang, IEEE Trans. Plasma Sci. 38, 1892 (2010). https://doi.org/10.1109/TPS.2009.2039585
  21. H. Lim, D. Kim, J. Kim, S. Han, and G. Cho, J. Korean Vac. Soc. 20, 14 (2011). https://doi.org/10.5757/JKVS.2011.20.1.014
  22. Y. J. Kim, S. Jin, G. Han, G. Kwon, J. Choi, E. Choi, H. Uhm, and G. Cho, IEEE Trans. Plasma Sci. 43, 944 (2015). https://doi.org/10.1109/TPS.2015.2388775
  23. C. S. Ha, J. Shin, H. Lee, and H. J. Lee, Appl. Sci. Converg. Technol. 24, 16 (2015). https://doi.org/10.5757/ASCT.2015.24.1.16
  24. H. Bae, J. Y. Lee, and H. J. Lee, Appl. Sci. Converg. Technol. 26, 74 (2017). https://doi.org/10.5757/ASCT.2017.26.4.74
  25. Y. Kim, H. Cho, J. G. Kim, Y. Kim, G. H. Han, E. H. Choi, and G. Cho, in 43rd IEEE Int'l. Conf. on Plasma Sci. (Banff, Canada, June 19-23, 2016).