Fig. 1. General power module configuration diagram.
Fig. 2. Mesh of power module.
Fig. 3-1. Results of warpage analysis on DBC ceramic bondingprocess (AlN).
Fig. 3-2. Results of warpage analysis on DBC ceramic bonding process (Si3Nx substrate).
Fig. 4-1. Results of warpage analysis on heat resistance test (AlN substrate).
Fig. 4-2. Results of warpage analysis on heat resistance test (Si3Nx substrate).
Fig. 5-1. Results contour of AlN substrate on module drive test.
Fig. 5-2. Results contour of Si3Nx substrate on module drive test.
Table 1. Material properties data used in the simulation.
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