Journal of Internet Computing and Services (인터넷정보학회논문지)

Korean Society for Internet Information (한국인터넷정보학회)
권호 표지
DOI QR코드

DOI QR Code

Analysis of DIC Platform and Image Quality with FHD for Displacement Measurement

FHD급 DIC 플랫폼의 변위계측용 영상품질 분석

  • Received : 2017.10.27
  • Accepted : 2017.12.21
  • Published : 2018.02.28
Download PDF
⟨ Previous Next ⟩

Abstract

This paper presents the analysis of image quality with FHD(Full HD) resolution camera equipped DIC(Digital Image Correlation) platform for the measurement of the architectural structure's relative displacement. DIC platform was designed based on i.MX6 of Freescale. Displacement measurement based on DIC method, the error is affected by image quality factors as pixel number, brightness, contrast, and SNR[dB](Signal to Noise Ratio). The effect were analyzed. The displacement of ROI(Region Of Interest) area within the image was measured by sub-pixel units based on DIC method. The non-contact telemetry property of DIC method, it can be used to long distance non-contact measurement. The various displacement results was measured and analyzed with the image quality factor adjustment according to the distance(25m, 35m, 50m).

건축 구조물의 상대적인 변위 계측을 위하여 2메가 픽셀 Full HD(FHD) 해상도의 카메라와 디지털 영상상관(DIC, Digital Image Correlation) 플랫폼을 설계하고, 계측에 영향을 주는 영상 품질을 분석하였다. DIC 플랫폼은 Freescale사의 I.MX6를 기반으로 설계하였다. 영상 상관을 이용한 계측은 영상의 품질에 따라 계측 정밀도에 영향을 줄 수 있는데, 이러한 영상 품질 요인으로 영상의 밝기(brightness), 대조(contrast), 신호대 잡음비(SNR, Signal to Noise Ratio)를 분석하였다. 관심 영역(ROI, Region Of Interest)으로 설정한 부분에서 추출한 영상을 기준 영상으로 삼고, 일정 시간 경과 후 디지털 영상 상관(DIC)을 이용하여 기준 영상의 이동을 화소 및 부화소 단위로 추적 계산하여 변위를 측정하였다. 더불어 DIC 기반의 비접촉 원격 계측의 유효성을 파악하기 위하여 25m, 35m, 50m의 계측 거리에서, 영상 품질 요인 및 ROI 의 크기를 조정하여 측정을 하고 정밀도를 분석하였다.

Keywords

References

  1. D.H.,Kim et al, "Platform Design of Displacement based on Image Correlation for Disaster Safety," 2016 Korean Society for Internet Information Conference, Vol.17, No.2, pp. 85-86, 2016. https://www.dbpia.co.kr/Journal/ArticleList/VOIS00290203
  2. S.W., Kim, N.S.,Kim, "Multi-point Dynamic Displacement Measurements of Structures Using Digital Image Correlation Technique," Earthquake Engineering Society of Korea, Vol.13, No.3, pp. 11-19, 2009. http://www.ndsl.kr/ndsl/commons/util/ndslOriginalView.do?cn=JAKO200921140052320&dbt=JAKO&koi=KISTI1.1003%2FJNL.JAKO200921140052320
  3. Oh Heon Kwon et al, "A Study of the Strain Measurement for Al 6061-T6 Tensile Specimen using the Digital Image Correlation," The Korean Society of Safety, Vol.28, No.4, pp. 26-32, 2013. http://uci.or.kr/G704-000647.2013.28.4.008
  4. J.H., Lee et al, "Vision-Based Displacement Measurement System Operable at Arbitrary Positions", Korea Institute for Structural Maintenance and Inspection, Vol.18, No.6, pp. 123-130, 2014. http://dx.doi.org/10.11112/jksmi.2014.18.6.123
  5. J.H., Choi et al,, "Study on the Development of the Digital Image Correlation Measurements Program for easuring the 3-Point Bending Test," Journal of the Korean Society for Precision Engineering, Vol.31, No.10, pp. 889-895, 2014. http://dx.doi.org/10.7736/KSPE.2014.31.10.889
  6. Lee J.J., Shinozuka, M., "Real-time displacement of a flexural bridge using digital image processing technique," Experimental Mechanics, Vol. 46, 105-114, 2006. https://link.springer.com/article/10.1007%2Fs11340-006-6124-2 https://doi.org/10.1007/s11340-006-6124-2
  7. Bing Pan1, Kemao Qian, Huimin Xie and Anand Asundi," Two-dimensional digital image correlation for in-plane displacement and strain measurement," MEASUREMENT SCIENCE AND TECHNOLOGY, 20, 2009.
  8. Reu, Phillip L.; Sweatt, William ; Miller, Timothy ; Fleming, Darryn, "Title: Camera system resolution and its influence on digital image correlation," Experimental Mechanics, Volume 55, issue 1, pp 9-25, 2015. https://doi.org/10.1007/s11340-014-9886-y
  9. Misganu Debella-Gilo, Andreas Kaab, "Sub-pixel precision image matching for measuring surface displacements on mass movements using normalized cross-correlation," Remote Sensing of Environment 115, pp. 130-142, 2011 https://doi.org/10.1016/j.rse.2010.08.012
  10. i.MX 6Dual/6Quad Applications Processor Reference Manual, free scale semiconductor. Inc. 2015. http://www.nxp.com/products/microcontrollers-and-processors/arm-processors/i.mx-applications-processors/i.mx-6-processors:IMX6X_SERIES