Journal of Convergence for Information Technology (융합정보논문지)

Convergence Society for SMB (중소기업융합학회)
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Convergence Study on FTO Film Etchant

FTO 필름 식각액에 관한 융합연구

  • Han, Doo-Hee (Industrial Technology Convergence Research Institute, Chungwoon University) ;
  • Yang, Ui-Dong (Chungwoon University Dept. of Global Management)
  • 한두희 (청운대학교 중소기업기술융합연구소) ;
  • 양의동 (청운대학교 글로벌경영학과)
  • Received : 2018.10.04
  • Accepted : 2018.12.20
  • Published : 2018.12.31
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Abstract

An etchant capable of forming a circuit in an FTO film that can replace ITO, which depends on full imports, was prepared. The etching solution is composed of 1 to 30% by weight of fluoride, 1 to 20% by weight of acid, 0.5 to 5% by weight of surfactant, 5 to 20% by weight of solvent, 0.5 to 10% by weight of corrosion inhibitor and the balance of water. This etchant can be etched using a dry film, thereby reducing the cost, and is free from bubbles and residue of the etchant. The characteristics of the etchant were etched in a time of 2 minute with a 100 nm thick FTO, and the etchant temperature was maintained at $50^{\circ}C$. An undercut of -0.00364% was obtained when put into a 2 minute etching solution. No harmful substances such as Cd, Pb, Hg and Cr components were measured. The use of FTO in Korea where rare earths do not exist can achieve localization and import substitution effect.

완전 수입에 의존하는 ITO를 대체할 수 있는 FTO 필름에 회로를 형성시킬 수 있는 식각액을 제조하였다. 이 식각액은 불화물 1 ~ 30량%, 산 1 ~ 20량%, 계면활성제 0.5 ~ 5 중량%, 용매제 5 ~ 20 량%, 부식억제제 0.5 ~ 10중량%, 나머지는 물로 이루어진다. 이 식각액은 드라이필름을 이용한 식각공정이 가능하여 비용을 절감할 수 있으며, 식각액의 거품발생 및 찌꺼기가 발생하지 않는 특징이 있다. 식각액의 특성은 100nm 두께의 FTO를 2분 만에 식각할 수 있었고 이때 $50^{\circ}C$의 식각액 온도를 유지하였다. 2분 식각액에 넣었을 때 -0.00364%의 언더컷을 얻었다. Cd, Pb, Hg, Cr 성분 등의 환경유해물질은 측정되지 않았다. 희토류가 나지 않는 우리나라에서 FTO를 활용하면 국산화 및 수입대체효과를 이룩할 수 있다.

Keywords

JKOHBZ_2018_v8n6_43_f0001.png 이미지

Fig. 1. Etching Speed according to fluorine compounds

JKOHBZ_2018_v8n6_43_f0002.png 이미지

Fig. 2. Etching Speed according to Acid Type

JKOHBZ_2018_v8n6_43_f0003.png 이미지

Fig. 3. Etching Speed according to fluorine compound content

JKOHBZ_2018_v8n6_43_f0004.png 이미지

Fig. 4. Etching Speed according to Acid Content

JKOHBZ_2018_v8n6_43_f0005.png 이미지

Fig. 5. Surface tension test according to surfactant content

JKOHBZ_2018_v8n6_43_f0006.png 이미지

Fig. 6. Confirmation of pattern formation(L: before etching, R: after etching)

JKOHBZ_2018_v8n6_43_f0007.png 이미지

Fig. 7. Testing flow chart for RoHS: Cd/Pb/Hg/Cr6+ testing

JKOHBZ_2018_v8n6_43_f0008.png 이미지

Fig. 8. Wet etching pretreatment process

JKOHBZ_2018_v8n6_43_f0009.png 이미지

Fig. 9. FIB measurement result.(1st angle)

JKOHBZ_2018_v8n6_43_f0010.png 이미지

Fig. 10. FIB measurement result.(2nd angle)

JKOHBZ_2018_v8n6_43_f0011.png 이미지

Fig. 11. Before etching

JKOHBZ_2018_v8n6_43_f0012.png 이미지

Fig. 12. Etching After 90seconds

JKOHBZ_2018_v8n6_43_f0013.png 이미지

Fig. 13. Etching After 120seconds

JKOHBZ_2018_v8n6_43_f0014.png 이미지

Fig. 14. Sn content for dipping time

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Fig. 15. Ingradient analysis(SEM/EDS)

Table 1. Surface tension according to surfactant content

JKOHBZ_2018_v8n6_43_t0001.png 이미지

Table 2. Etchig Condition Result

JKOHBZ_2018_v8n6_43_t0002.png 이미지

Table 3. Hazardous substance inspection

JKOHBZ_2018_v8n6_43_t0003.png 이미지

Table 4. Undercut result

JKOHBZ_2018_v8n6_43_t0004.png 이미지

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