반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

3D 적층 IC제조를 위한 웨이퍼 휨 측정법

Novel Wafer Warpage Measurement Method for 3D Stacked IC

  • 김성동 (서울과학기술대학교 기계시스템디자인공학과) ;
  • 정주환 (동부하이텍)
  • Kim, Sungdong (Dept. of Mechanical System Design Engineering, Seoul National University of Science and Technology) ;
  • Jung, Juhwan (DB Hitek)
  • 투고 : 2018.12.14
  • 심사 : 2018.12.20
  • 발행 : 2018.12.31
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초록

Standards related to express the non-flatness of a wafer are reviewed and discussed, for example, bow, warp, and sori. Novel wafer warpage measurement method is proposed for 3D stacked IC application. The new way measures heat transfer from a heater to a wafer, which is a function of the contact area between these two surfaces and in turn, this contact area depends on the wafer warpage. Measurement options such as heating from room temperature and cooling from high temperature were experimentally examined. The heating method was found to be sensitive to environmental conditions. The cooling technique showed more robust and repeatable results and the further investigation for the optimal cooling condition is underway.

키워드

참고문헌

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