The Journal of Korean Institute of Electromagnetic Engineering and Science (한국전자파학회논문지)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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Electromagnetic Field Coupling of Small Metallic Cans in Mobile Devices

모바일 기기용 소형 금속 캔의 전자기장 결합 특성

  • Park, Hyun Ho (School of Electric & Electronic Engineering, University of Suwon)
  • 박현호 (수원대학교 전기전자공학부)
  • Received : 2017.08.14
  • Accepted : 2017.10.24
  • Published : 2017.11.30
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Abstract

This paper examines electromagnetic leakage path of small shield cans employed in mobile devices such as smart-phones by using numerical simulation and analyzes near-field coupling due to each of the leakage electric and magnetic fields by using IC-stripline method. From the results, it is confirmed that the leakage from the apertures or slots on the top of shield can is dominated by magnetic field, whereas the leakage from the seam on the side of shield can is mostly caused by electric field.

본 논문에서는 모바일 기기용 소형 금속 캔으로부터 발생하는 전자기장의 누설 경로를 시뮬레이션을 통해 확인하고, IC-stripline 방법을 이용하여 전기장 및 자기장에 대한 근접장 결합(coupling) 현상을 분석하였다. 금속 캔의 윗면 개구부에 의한 전자기장 누설은 주로 자기장이 우세하고, 측면을 통한 누설은 전기장이 우세함을 확인하였다.

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References

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