References
- C. S. Mccandish and A. L. Dow, Outlook for thick film hybrids 1985 - 90, Am. Ceram. Soc. Bull., 63 (1985) 547.
-
T. Inokuma, Y. Taketa and M. Haradome, The Microstructure of
$RuO_2$ thick film resistors and the Influence of glass particle size on their electrical properties, IEEE Trans. Component, Hybrid. Manuf Tech., CHMT-7 [2] (1984) 166-75. - F. Miyashiro, N. Iwase, A. Tsuge, F. Ueno, M. Nakahashi and T. Takahashi, High thermal conductivity aluminum nitride ceramic substrates and packages, IEEE trans. Components, Hybrids and Manufacturing Technology, 13 (1990) 313-319. https://doi.org/10.1109/33.56163
- G. Reppe, C. Kretzschmar, A. Scheffel, H. Thust, T. Kirchner and M. Grobe, Realization of attenuators and termination in thick film technology on AlN-substrates, 11th European Microelectronics conference (1997) 69-76.
-
O. Abe, Y. Taketa and M. Haradome, The effect of various factors on the resistance and TCR of
$RuO_2$ thick film resistors-Relation between the electrical properties and particle size of constituents, the physical properties of glass and firing temperature, Active and Passive Elec., 13 (1988) 67-83. https://doi.org/10.1155/1988/67016 - M. Hrovat, Z. Samardzija and J. Holc, The development of microstructural and electrical characteristics in some thick-film resistors during firing, J. Mater. Sci., 37 (2002) 2331-39. https://doi.org/10.1023/A:1015385704068
- C. Kretzschmar, P. Otschik, K. Jaenicke-Rossler and D. SchlAfer, The reaction between ruthenium dioxide and aluminium nitride in resistor pastes, J. Mater. Sci., 28 (1993) 5713-16. https://doi.org/10.1007/BF00365170
-
L. S. Chen, S. L. Fu and J. H. Wu, Electrical properties of
$Al_2O_3$ and$MnO_2$ -doped thick film resistors on AlN substrates, Jpn. J. Appl. Phys., 41 (2002) 2969-73. https://doi.org/10.1143/JJAP.41.2969 -
M. S. Kim, H. J. Kim, H. T. Kim, D. J. Kim, Y. D. Kim and S. S. Ryu, Electrical properties of eco-friendly
$RuO_{2}$ -based thick-film resistors containing CaO-ZnO-$B_2O_3-Al_2O_3-SiO_2$ system glass for AlN substrate, Journal of the Korean Ceramic Society, 47 (2010) 467-473. https://doi.org/10.4191/KCERS.2010.47.5.467 - M. V. H. Rao, V. D. Giramkar, G. J. Phatak, D. P. Amalnerkar, K. S. Sastri and V. N. Krishnamurthy, Microstructure and electrical properties of 'pre-sintered bismuth ruthenate-glass composite' based thick film paste for resistor application, International Journal of Electronics, 92 (2005) 451-466. https://doi.org/10.1080/08827510310001648861
- R. W. Vest; Ceramic Materials for Electronics: Processing, Properties and Application, ed. R. C. Buchanan, Marcel Dekker 2nd ed., New York (1991) 473.
-
T. Yamaguchi and K. Iizuka, Microstructure development in
$RuO_2$ -glass thick film resistors and its effect on the electrical resistivity, J. Am. Ceram. Sci., 73 (1984) 166-75.