References
- Hsieh, H. H., et al. "The effects of temperature and solders on the wettability between ribbon and solar cell." Solar Energy Materials and Solar Cells, Vol. 93, No. 6, pp.864-868, 2009. https://doi.org/10.1016/j.solmat.2008.10.005
- Kim, S. J., et al. "Soldering Process of PV Module Manufacturing and Reliability." Korean Solar Energy Society Conference Proceedings, 2011.
- So, A. C. K. and Yan, C. C. "Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints." Electronic Components and Technology Conference, 1996. Proceedings., 46th. IEEE, 1996.
- Yang, T. L., et al. "Growth kinetics of Ag 3 Sn in silicon solar cells with a sintered Ag metallization layer." Solar Energy Materials and Solar Cells, 123 pp.139-143, 2014. https://doi.org/10.1016/j.solmat.2014.01.018
- Gao, W., et al. "Effect of glass phase on solder joint reliability in crystalline silicon photovoltaic modules." Journal of Materials Science: Materials in Electronics, Vol. 26, No. 10, pp.7811-7814, 2015. https://doi.org/10.1007/s10854-015-3429-x
- Che, F. X., John H. L. P. "Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn-3.8 Ag-0.7 Cu solder joints." Journal of Alloys and Compounds, 541, pp.6-13, 2012. https://doi.org/10.1016/j.jallcom.2012.06.104
- Jeong, J. S., Park, N.C., and Han, C.W. "Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module." Microelectronics Reliability, Vol. 52, No. 9, pp.2326-2330, 2012. https://doi.org/10.1016/j.microrel.2012.06.027
- Chuang, C. M., and Lin, K. L. "Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate." Journal of Electronic Materials, Vol. 32, No. 12, pp.1426-1431, 2003. https://doi.org/10.1007/s11664-003-0111-5
- Geipel, T., et al. "Intermetallic compounds in solar cell interconnections: Microstructure and growth kinetics." Solar Energy Materials and Solar Cells, 159, pp.370-388, 2017. https://doi.org/10.1016/j.solmat.2016.08.039
- Wassink, R. J. K. Soldering in Electronics (Ayr, Scotland: Electrochemical Publications Ltd., pp.149-159. 1989.