마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제24권2호
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  • Pages.69-74
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  • 2017
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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후속 열처리조건이 스크린 프린팅 Ag 박막과 폴리이미드 사이의 필강도에 미치는 영향

Effect of Post-Annealing Condition on the Peel Strength of Screen-printed Ag Film and Polyimide Substrate

  • 배병현 ((주)비츠로테크) ;
  • 이현철 ((주)스태츠칩팩코리아) ;
  • 손기락 (안동대학교 신소재공학부 청정에너지소재기술연구센터) ;
  • 박영배 (안동대학교 신소재공학부 청정에너지소재기술연구센터)
  • 투고 : 2017.06.08
  • 심사 : 2017.06.26
  • 발행 : 2017.06.30
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초록

인쇄전자소자 금속 배선의 고온 신뢰성 평가를 위해 스크린 프린팅 기법으로 도포된 Ag 박막과 폴리이미드 기판 사이의 계면접착력을 $200^{\circ}C$ 후속 열처리 시간에 따라 $180^{\circ}$ 필 테스트를 통해 평가하였고, 박리 계면 미세구조를 분석하였다. 후속 열처리 전 필 강도는 약 16.7 gf/mm 이었고, 열처리 24 시간 후 필 강도는 29.4 gf/mm까지 증가하였는데, 이는 초기 열처리에 의해 접합계면에서 Ag-O-C 화학 결합의 증가와 바인더의 organic bridges 효과가 주 원인인 것으로 판단된다. 한편, 열처리 시간이 48, 100, 250, 500 시간으로 더욱 증가함에 따라 필 강도는 각각 22.3, 3.6, 0.6, 0.1 gf/mm으로 급격히 감소하는 거동을 보였다. 이는 $200^{\circ}C$의 고온에서 장시간 노출되었을 때 Cu/Ag 계면 산화막 형성이 주 원인인 것으로 판단된다.

Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.

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참고문헌

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