참고문헌
- J.-H. Ahn, H. Lee, and S.-H. Choa, "Technology of Flexible Semiconductor/Memory Device", J. Microelectron. Packag. Soc., 20(2), 1, (2013). https://doi.org/10.6117/kmeps.2013.20.2.001
- T.-I. Lee, C. Kim, M. S. Kim, and T.-S. Kim, "Measurement of Flexural Modulus of Lamination Layers on Flexible Substrates", J. Microelectron. Packag. Soc., 23(3), 63, (2016). https://doi.org/10.6117/KMEPS.2016.23.3.063
- Y. Shang, C. Wang, X. He, J. Li, Q. Peng, E. Shi, R. Wang, S. Du, A. Cao, and Y. Li, "Self-stretchable, helical carbon nanotube yarn supercapacitors with stable performance under extreme deformation conditions", Nano Energy, 12, 401, (2015). https://doi.org/10.1016/j.nanoen.2014.11.048
- L. G. D. Arco, Y. Zhang, C. W. Schlenker, K. Ryu, M. E. Thompson, and C. Zhou, "Continuous, Highly Flexible, and Transparent Graphene Films by Chemical Vapor Deposition for Organic Photovoltaics", ACS Nano, 4, 2865, (2010). https://doi.org/10.1021/nn901587x
- J. Jin, J.-H. Ko, S. Yang, B.-S. Bae, "Rollable Transparent Glass-Fabric Reinforced Composite Substrate for Flexible Devices", Adv. Mater., 22, 4510, (2010). https://doi.org/10.1002/adma.201002198
- C. Kim, T.-I. Lee, and T.-S. Kim, "Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging", J. Microelectron. Packag. Soc., 23(2), 19, (2016). https://doi.org/10.6117/kmeps.2016.23.2.019
- M. J. Mack, "Minimally Invasive and Robotic Surgery", JAMA, 285, 568, (2001). https://doi.org/10.1001/jama.285.5.568
- A. M. Okamura, "Haptic Feedback in Robot-Assited Minimally Invasive Surgery", Curr. Opin. Urol, 19, 102, (2009). https://doi.org/10.1097/MOU.0b013e32831a478c
- Y. Haga, and M. Esashi, "Biomedical Microsystems for Minimally Invasive Diagnosis and Treatment", Proc. IEEE, 92, (2004).
- M. F. Metzger, T. S. Wilson, D. Schumann, D. L. Matthews, and D. J. Maitland, "Mechanical Properties of Mechanical Actuator for Treating Ischemic Stroke", Biomed. Microdevices, 4, 89, (2002). https://doi.org/10.1023/A:1014674912979
- M. Shahinpoor, and K. J. Kim, "Ionic polymer-metal composites: I. Fundamentals", Smart Mater. Struct., 10, 819, (2001). https://doi.org/10.1088/0964-1726/10/4/327
- S. Ruiz, B. Mead, V. Palmre, K. J. Kim, and W. Yim, "Corrigendum: A cylindrical ionic polymer-metal composite-based robotic catheter platform: modeling, design and control", Smart Mater. Struct., 24, 1, (2015).
- P. H. Lau, K. Takei, C. Wang, Y. Ju, J. Kim, Z. Yu, T. Takahashi, G. Cho, and A. Javey, "Fully Printed, High Performance Carbon Nanotube Thin-Film Transistors on Flexible Substrates", Nano Lett., 13, 3864, (2013). https://doi.org/10.1021/nl401934a
- A. Russo, B. Y. Ahn, J. J. Adams, E. B. Duoss, J. T. Bernhard, and J. A. Lewis, "Pen-on-Paper Flexible Electronics", Adv. Mater., 23, 3426, (2011). https://doi.org/10.1002/adma.201101328
- H. M. Ho, W. Lam, S. Stoukatch, P. Ratchev, C. J. Vath III, and E. Beyne, "Direct gold and copper wires bonding on copper", Microelectronics Reliability, 43, 913, (2003). https://doi.org/10.1016/S0026-2714(03)00074-X
- B. Goss, "Bonding glass and other substrates with UV curing adhesives", Int. J. Adhes. Adhes., 22, 405, (2002). https://doi.org/10.1016/S0143-7496(02)00022-2
- C. D. Petruczok, and K. K. Gleason, "Initiated Chemical Vapor Deposition-Based Method for Patterning Polymer and Metal Microstructures on Curved Substrates", Adv. Mater., 24, 6445, (2012). https://doi.org/10.1002/adma.201201975
- M. Ahamed, M. S. Alsalhi, and M. K. J. Siddiqui, "Silver nanoparticle applications and human health", Clin. Chim. Acta, 411, 1841, (2010). https://doi.org/10.1016/j.cca.2010.08.016
- L. Morris, N. Hynes, S. Sultan, P. McCarthy, P. Delassus, and P. Fahy, "An In Vitro Assessment of the Cerebral Hemodynamics Through Three Patient Specific Circle of Willis Geometries", J. Biomed. Eng., 136, 011007, (2014).
- K. Studer, C. Decker, E. Beck, and R. Schwalm, "Overcoming oxygen inhibition in UV-curing of acrylate coatings by carbon dioxide inerting, Part I", Prog. Org. Coat., 48, 92, (2003). https://doi.org/10.1016/S0300-9440(03)00120-6
- K. S. Kim, J. Y. Song, E. K. Chung, J. K. Park, and S. H. Hong, "Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires", Mech. Mater., 38, 119, (2006). https://doi.org/10.1016/j.mechmat.2005.05.015