Structural Engineering and Mechanics

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Study on dynamic interaction between crack and inclusion or void by using XFEM

  • Jiang, Shouyan (Department of Engineering Mechanics, Hohai University) ;
  • Du, Chengbin (Department of Engineering Mechanics, Hohai University)
  • Received : 2016.10.25
  • Accepted : 2017.03.30
  • Published : 2017.08.10
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Abstract

This paper devoted to study dynamic interaction between crack and inclusion or void by developing the eXtended Finite Element Methods (XFEM). A novel XFEM approximation is presented for these structures containing multi discontinuities (void, inclusion, and crack). The level set methods are used so that elements that include a crack segment, the boundary of a void, or the boundary of an inclusion are not required to conform to discontinuous edges. The investigation covers the effects of a single circular or elliptical void / stiff inclusion, and multi stiff inclusions on the crack propagation path under dynamic loads. Both the void and the inclusion have a significant effect on the dynamic crack propagation path. The crack initially curves towards into the void, then, the crack moves round the void and propagates away the void. If a large void lies in front of crack tip, the crack may propagate into the void. If an enough small void lies in front of crack tip, the void may have a slight or no influence on the crack propagation path. For a stiff inclusion, the crack initially propagates away the inclusion, then, after the crack moves round the inclusion, it starts to propagate along its original path. As ${\delta}$ (the ratio of the elastic modulus of the inclusion to that of the matrix) increases, a larger curvature of the crack path deflection can be observed. However, as ${\delta}$ increases from 2 to 10, the curvature has an evident increase. By comparison, the curvature has a slight increase, as ${\delta}$ increases from 10 to 1000.

Keywords

Acknowledgement

Supported by : National Natural Science Foundation of China, Central Universities, China Postdoctoral Science Foundation

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