Transactions on Electrical and Electronic Materials

  • 제18권3호
  • /
  • Pages.148-150
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  • 2017
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  • 1229-7607(pISSN)
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  • 2092-7592(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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Characterization of a Functional Coating Film Synthesized on the Ceramic Substrate for Electrical Insulator Application according to Coating Method

  • Shan, Bowen (Department of Electrical Engineering, Hanbat National University) ;
  • Kang, Hyunil (Department of Electrical Engineering, Hanbat National University) ;
  • Choi, Wonseok (Department of Electrical Engineering, Hanbat National University) ;
  • Kim, Jung Hyun (Department of Advanced Materials Science and Engineering, Hanbat National University)
  • 투고 : 2017.03.23
  • 심사 : 2017.04.06
  • 발행 : 2017.06.25
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초록

For the improvement of the anti-fouling features of porcelain electrical insulators, in this study, the surface of an insulator was coated with a functional material to expand the insulator's self-cleanness. The anti-fouling and mechanical features of the functional film coating of ceramic substrates made from components like an electrical insulator were analyzed. The coating methods that were used were spray coating, dip coating, and fabric coating. Following the coating, the contact angle of the coated surface was measured, revealing that the spray coating method offered the lowest angle ($13.7^{\circ}$) and a strong hydrophilic feature. The anti-fouling analysis showed that the anti-fouling features improved as the contact angle decreased. The mechanical properties - hardness and adhesion - were both excellent at 9H and 5B, respectively, regardless of the coating method that was used.

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참고문헌

  1. R. A. Islam, Y. C. Chan, and M. F. Islam, Mater. Sci. Eng., B., 106, 132 (2004). [DOI: https://doi.org/10.1016/j.mseb.2003.09.005]
  2. P. J. Lambeth, Proc. Inst. Electr. Eng., 118, 1107 (1971). [DOI: https://doi.org/10.1049/piee.1971.0245]
  3. R. S. Gorur, E. Cherney, C. de Tourreil, D. Dumora, R. Harmon, H. Hervig, B. Kingsbury, J. Kise, T. Orbeck, K. Tanaka, R. Tay, G. Toskey, and D. Wiitanen, IEEE Trans. Power Delivery, 10, 924 (1995). [DOI: https://doi.org/10.1109/61.400837]
  4. K. K. Yu, G. J. Zhang, G. Q. Liu, X. P. Ma, and G. X. Li, IEEE Trans. Dielectr. Electr. Insul., 15, 1464 (2008). [DOI: https://doi.org/10.1109/TDEI.2008.4656257]
  5. R. Sundararajan and R. S. Gorur, IEEE Trans. Dielectr. Electr. Insul., 3, 113 (1996). [DOI: https://doi.org/10.1109/94.485522]
  6. Y. Z. Lv, C. R. Li, F. C. Wang, Y. F. Du, Y. J. Yang, Y. P. Liu, and W. Cai, Proc. IEEE 9th International Conference on the Properties and Applications of Dielectric Materials (Harbin, China, 2009) P. 158. [DOI: https://doi.org/10.1109/ICPADM.2009.5252481]
  7. K. Woan, G. Pyrgiotakis, and W. Sigmund, Adv. Mater., 21, 2233 (2009). [DOI: https://doi.org/10.1002/adma.200802738]
  8. C. W. Zou and W. Gao, Trans. Electr. Electron. Mater., 11, 1 (2010). [DOI: https://doi.org/10.4313/TEEM.2010.11.1.001]
  9. G. Bracco and B. Holst, Surf. Sci. Tech., 51, 333 (2013). [DOI: https://doi.org/10.1007/978-3-642-34243-1]
  10. A. K. Tiwari, H. Kumar, R. Bajpai, and S. K. Tripathi, J. Chem. Pharm. Res., 2, 172 (2010).
  11. M. E. McKnight, J. F. Seiler, T. Nguyen, and W. J. Rossiter, J. Prot. Coat. Linings., 12, 82 (1995).