반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

웨이퍼 본딩 공정을 위한 3채널 비전 얼라이너 개발

Development of The 3-channel Vision Aligner for Wafer Bonding Process

  • 김종원 (한국기술교육대학교 기전융합공학과) ;
  • 고진석 ((주)마이크로비전)
  • Kim, JongWon (Electromechanical Convergence Engineering, Korea University of Technology and Education) ;
  • Ko, JinSeok (MicroVision Co., Ltd)
  • 투고 : 2017.03.03
  • 심사 : 2017.03.24
  • 발행 : 2017.03.31
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초록

This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

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참고문헌

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