References
- H. Xiao, "Introduction to Semiconductor Manufacturing Technology," Washington: SPIE press in United States, (2012)
- M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu and S. K. Kamaruddin, "A study on the effect of epoxy molding compound (EMC) rheology during encapsulation of stacked-CHIP scale packages (S-CSP)," Journal of Reinforced Plastics and Composites, Vol. 28, pp. 2527-2538 (2009) https://doi.org/10.1177/0731684408092409
- A. Haleh, "Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging," IEEE Transactions on Components and Packaging Technologies, Vol. 26, pp. 206-214 (2003) https://doi.org/10.1109/TCAPT.2002.806172
- C. Y. Khor, M. A. Abdullah, Z. M. Ariff and W. C. Leong, "Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package," International Communications in Heat and Mass Transfer, Vol. 39, pp. 670-680 (2012) https://doi.org/10.1016/j.icheatmasstransfer.2012.03.023
- T. Tian, K. Chen, A. MacDowell, D. Parkinson, T. Lai and K. N. Tu, "Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints," Scripta Materialia, Vol. 65, pp. 646-649 (2011) https://doi.org/10.1016/j.scriptamat.2011.07.002
- M. Clark, S. Sharples and M. Somekh, "Non-contact acoustic microscopy," Measurement Science and Technology, Vol. 11, pp. 1792-1801 (2000) https://doi.org/10.1088/0957-0233/11/12/320
- C. Meola and M. Carlomagno, "Recent advances in the use of infrared thermography," Measurement Science and Technology, Vol. 15, R27-R58 (2004) https://doi.org/10.1088/0957-0233/15/9/R01
- G. Busse, D. We and W. Karpen, "Thermal wave imaging with phase sensitive modulated thermography," Journal of Applied Physics, Vol. 71, No. 8, pp. 3962-3965 (1992) https://doi.org/10.1063/1.351366
- W. Bai and B. S. Wong, "Evaluation of defects in composite plates under convective environments using lock-in thermography," Measurement Science and Technology, Vol. 12, pp. 142-150 (2001) https://doi.org/10.1088/0957-0233/12/2/303
- M. Choi, K. Kang, J. Park, W. Kim and K. Kim, "Quantitative determination of a subsurface defect of reference specimen by lock-in infrared thermography," NDT&E International, Vol. 41, pp. 119-124 (2008) https://doi.org/10.1016/j.ndteint.2007.08.006
- S. Dudzik, "Approximation of thermal background applied to defect detection using the methods of active thermography," Metrology and Measurement Systems, Vol. 17, pp. 621-636 (2010)
- M. Balu, T. Baldacchini, J. Carter, T. B. Krasieva, R. Zadoyan and B. J. Tromberg, "Effect of excitation wavelength on penetration depth in nonlinear optical microscopy of turbid media," Journal of Biomedical Optics, Vol. 14, 010508 (2009) https://doi.org/10.1117/1.3081544
- G. Traxler, M. Scheerer and C. Steiger, "Square pulse thermography system design considerations for detection of voids inside of the material with different properties and finite differences," Proceedings of SPIE, Vol. 5679, pp. 118-128 (2005)
- HL. John IV, HL. John V, "A heat transfer textbook," 4th ed. Cambridge: Phlogiston Press in United States, (2008)
- J. Liu, W. Yang and J. Dai, "Research on thermal wave processing of lock-in thermography based on analyzing image sequences for NDT," Infrared Physics & Technology, Vol. 53, pp. 348-357 (2010) https://doi.org/10.1016/j.infrared.2010.06.002
- A. Rinaldi and D. Krajcinovic, "Statistical damage mechanics and extreme value theory," International Journal of Damage Mechanics, Vol. 16, pp. 57-76 (2015)
- R. H. Chan, C. W. Ho, Nikolova M, "Salt-and-pepper noise removal by median-type noise detectors and detail-preserving regularization," IEEE Transaction on Image Processing, pp. 14 1479-1485 (2005) https://doi.org/10.1109/TIP.2005.852196