참고문헌
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- Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint vol.35, pp.6, 2017, https://doi.org/10.5781/JWJ.2017.35.6.8
- Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints 2018, https://doi.org/10.1007/s10854-017-8426-9
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- Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration vol.39, pp.1, 2017, https://doi.org/10.5781/jwj.2021.39.1.11
- MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes vol.39, pp.4, 2017, https://doi.org/10.5781/jwj.2021.39.4.2
- Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing vol.39, pp.4, 2017, https://doi.org/10.5781/jwj.2021.39.4.4