References
- K. Raggl, T. Nussbaumer and J. Kolar, "Guideline for a simplified differential-mode EMI filter design," IEEE Trans. Ind. Electron., Vol. 57, No. 3, pp. 1031-1040, March 2010. https://doi.org/10.1109/TIE.2009.2028293
- H. Akagi and T. Shimizu, "Attenuation of conducted EMI emissions from an inverter-driven motor," IEEE Trans. Power Electron., Vol. 23, No. 1, pp. 282-290, Jan. 2008. https://doi.org/10.1109/TPEL.2007.911878
- A. J. McDowell and T. H. Hubing, "A compact implementation of parasitic inductance cancellation for shunt capacitor filters on multilayer PCBs," IEEE Trans. Electromagn. Compat., Vol. 57, No. 2, pp. 257-263, Apr. 2015. https://doi.org/10.1109/TEMC.2014.2364990
- D. Shin , S. Kim, G. Jeong, J. Park, J. Park, K. J. Han, and J. Kim, "Analysis and design guide of active EMI filter in a compact package for reduction of common-mode conducted emissions," IEEE Trans. Electromagn. Compat., Vol. 57, No. 4, pp. 660-671, 2015. https://doi.org/10.1109/TEMC.2015.2401001
- J. Biela, A. Wirthmueller, R. Waespe, M. L. Heldwein, K. Raggl and J. W. Kolar, "Passive and active hybrid integrated EMI filters," IEEE Trans. Power Electron., Vol. 24, No. 5, pp. 1340-1349, May 2009. https://doi.org/10.1109/TPEL.2009.2012404
- Y. Maillet, R. Lai, S. Wang, F. Wang, R. Burgos and D. Boroyevich, "High-density EMI filter design for DC-fed motor drives," IEEE Trans. Power Electron., Vol. 25, No. 5, pp. 1163-1172, May 2010. https://doi.org/10.1109/TPEL.2009.2039004
- J. Espina, J. Balcells, A. Arias, and C. Ortega, "Common mode EMI model for a direct matrix converter," IEEE Trans. Ind. Electron., Vol. 58, No. 11, pp. 5049-5056, Nov. 2011. https://doi.org/10.1109/TIE.2011.2158774
- E. Rondon-Pinilla, F. Morel, C. Vollaire, and J. L. Schanen, "Modeling of a buck converter with a SiC JFET to predict EMC conducted emissions," IEEE Trans. Power Electron., Vol. 29, No. 5, pp. 2246-2260, May 2014. https://doi.org/10.1109/TPEL.2013.2295053
- M. Ferber, C. Vollaire, L. Krahenbuhl, J. L. Coulomb and J. A. Vasconcelos, "Conducted EMI of DC-DC converters with parametric uncertainties," IEEE Trans. Electromagn. Compat., Vol. 55, No. 4, pp. 699-706, Aug. 2013. https://doi.org/10.1109/TEMC.2012.2235443
- L. Zhai, B. Xu, N. Bondarenko, G. Li, T. Makharashvili, D. Loken, P. Berger, T. Van Doren, and D. Beetner, "A measurement - Based model of the electromagnetic emissions from a power inverter," IEEE Trans. Power Electron., Vol. 30, No. 10, pp. 5522-5531, Oct. 2015. https://doi.org/10.1109/TPEL.2014.2384030
- V. Ardon, J. Aime, O. Chadebec, E. Clavel, J. M. Guichon and E. Vialardi, "EMC modeling of an industrial variable speed drive with an adapted PEEC method," IEEE Trans. Magn., Vol. 46, No. 8, pp.2892-2898, 2010. https://doi.org/10.1109/TMAG.2010.2043420
- P. Musznicki, M. Turzynski, and P. J. Chrzan, "Accurate modeling of quasi-resonant inverter fed IM drive," in Proc. IECON 2013 , pp. 376-381, Nov. 2013.
- R. Mrad, F. Morel, G. Pillonnet, C. Vollaire, P. Lombard, and A. Nagari, "N-conductor passive circuit modeling for power converter current prediction and EMI aspect," IEEE Trans. Electromagn. Compat., Vol. 55, No. 6, pp. 1169-1177, 2013. https://doi.org/10.1109/TEMC.2013.2265048
- H. Wu, J. Zhang, and Y. Xing, "A family of multi-port buck-boost converters based on DC-link-inductors (DLIs)," IEEE Trans. Power Electron., Vol. 30, No. 2, pp. 735-746, Feb. 2015. https://doi.org/10.1109/TPEL.2014.2307883
- M. Hagiwara and H. Akagi, "Control and experiment of pulse width modulated modular multilevel converters," IEEE Trans. Power Electron., Vol. 24, No. 7, pp. 1737-1746, Jul. 2009. https://doi.org/10.1109/TPEL.2009.2014236
- G. Lei, R. W. Techentin, and B. K. Gilbert, "High-frequency characterization of power/ground-plane structures," IEEE Trans. Microw. Theory and Tech., Vol. 47, No. 5, pp. 562-569, May 1999. https://doi.org/10.1109/22.763156
- M. Hampe and S. Dickmann, "Damping of cavity-mode resonances in PCB power-bus structures using discrete capacitors," IEEE Trans. Electromagn. Compat., Vol. 47, No. 4, pp. 880-888, Nov. 2005. https://doi.org/10.1109/TEMC.2005.857355
- J. Fan, J. L. Drewniak, J. L. Knighten, N. W. Smith, A. Orlandi, T. P. Van Doren, T. H. Hubing and R. E. DuBroff, "Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs," IEEE Trans. Electromagn. Compat., Vol. 43, No. 4, pp. 588-599, Nov. 2001. https://doi.org/10.1109/15.974639
- Y. J. Kim, H. S. Yoon, S. Lee, G. Moon, J. Kim, and J. K. Wee, "An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards," IEEE Trans. Adv. Packag., Vol. 27, No. 1, pp. 97-106, 2004. https://doi.org/10.1109/TADVP.2004.825481
- M. Hampe, V. A. Palanisamy, and S. Dickmann, "Single summation expression for the impedance of rectangular PCB power-bus structures loaded with multiple lumped elements," IEEE Trans. Electromagn. Compat., Vol. 49, No. 1, pp. 58-67, Feb. 2007. https://doi.org/10.1109/TEMC.2006.888188
- M. Stumpf and M. Leone, "Efficient 2-D integral equation approach for the analysis of power bus structures with arbitrary shape," IEEE Trans. Electromagn. Compat., Vol. 51, No. 1, pp. 38-45, Feb. 2009. https://doi.org/10.1109/TEMC.2008.2009223
- M. Stumpf, "The time-domain contour integral method - An approach to the analysis of double - plane circuits," IEEE Trans. Electromagn. Compat., Vol. 56, No. 2, pp. 367-374, Apr. 2014. https://doi.org/10.1109/TEMC.2013.2280297
- L. D. Smith, R. Andersonm and T. Roy, "Power plane SPICE models and simulated performance for materials and geometries," IEEE Trans. Adv. Packag., Vol. 24, No. 3, pp. 277-287, Aug. 2001. https://doi.org/10.1109/6040.938294
- C. Guo and T. H. Hubing, "Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method," IEEE Trans. Adv. Packag., Vol. 29, No. 3, pp. 441-447, Aug. 2006. https://doi.org/10.1109/TADVP.2006.875089
- C. Bednarz, A. Mantzke, and M. Leone, "Efficient FEM-based modal circuit representation of arbitrarily shaped plate pairs," IEEE Trans. Electromagn. Compat., Vol. 56, No. 4, pp. 990-993, 2014. https://doi.org/10.1109/TEMC.2013.2294542
- H. M. Lee, S. Gao, E. X. Liu, G. S. Samudra and E. P. Li, "Two dimensional discontinuous Galerkin time-domain method for modeling of arbitrarily shaped power-ground planes,"IEEE Trans. Electromagn. Compat., Vol. 57, No. 6, pp. 1744-1747, Dec. 2015. https://doi.org/10.1109/TEMC.2015.2443019
- R. Sourajeet, and A. Dounavis, "Macromodeling of multilayered power distribution networks based on multiconductor transmission line approach," IEEE Trans. Comp. Packag. Manufact. Tech., Vol. 3, No. 6, pp. 1047-1056, 2013. https://doi.org/10.1109/TCPMT.2013.2245377
- J. -H. Kim and M. Swaminathan, "Modeling of irregular shaped power distribution planes using transmission matrix method," IEEE Trans. Adv. Packag., Vol. 24, No. 3, pp. 334-346, Aug. 2001. https://doi.org/10.1109/6040.938301
- L. Sevgi, "Electromagnetic modeling and simulation: challenges in validation, verification, and calibration," IEEE Trans. Electromagn. Compat., Vol. 56, No. 4, pp. 750-758, Aug. 2014. https://doi.org/10.1109/TEMC.2013.2280135
- D. M. Pozar, Microwave Engineering, John Wiley & Sons, 2009.
- A. Ales, J. L. Schanen, D. Moussaoui and J. Roudet, "Impedances identification of DC/DC converters for network EMC analysis," IEEE Trans. Power Electron., Vol. 29, No. 12, pp. 6445-6457, Dec. 2014. https://doi.org/10.1109/TPEL.2014.2302851
- D. Baudry, C. Arcambal, A. Louis, B. Mazari, and P. Eudeline, "Applications of the near-field techniques in EMC investigations," IEEE Trans. Electromagn. Compat., Vol. 49, No. 3, pp. 485-493, 2007. https://doi.org/10.1109/TEMC.2007.902194
- H. Shall, R. Zouheir Riah, and M. Kadi, "A 3-D near-field modeling approach for electromagnetic interference prediction," IEEE Trans. Electromagn. Compat., Vol. 56, No. 1, pp. 102-112, 2014. https://doi.org/10.1109/TEMC.2013.2274576
- H. W. Ott, Electromagnetic Compatibility Engineering, John Wiley & Sons, 2011.
- C. Rostamzadeh and B. Archambeault, "Numerical and experimental investigation of PCB ground-fill on radiated EMI," in Proc. IEEE ISEC, 2006.