Abstract
The design and manufacturing tehcnology of IC sockets beyond 0.3mm pitch were presented. We compared the developed IC socket with the conventional one especially on the core metal-insulation part. Advanced machining techniques were employed to provide high precision. Our wire electrodischarge machining and high speed machining centers were able to maintain the micro-scale precision. We performed an injection molding analysis using a commercial analysis tool to predict the performance of the developed IC socket. We found that the solidification of the plastic resin and the high level of the clamping force are responsible for the defects such as incomplete filling and short shot. From these results, we modified the IC socket and successfully remove the defects. We were also able to find out that the new design socket needs less maintenance cost.