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Thermal and Flow Analysis of a Driving Controller for Active Destruction Protections

능동 파괴 방호 구동제어기의 열 유동 해석

  • Ryu, Bong-Jo (Department of Mechanical Engineering, Hanbat National University) ;
  • Oh, Bu-Jin (Agency for Defense Development) ;
  • Kim, Youngshik (Department of Mechanical Engineering, Hanbat National University)
  • Received : 2016.10.25
  • Accepted : 2017.02.03
  • Published : 2017.02.28

Abstract

A driving controller for active destruction protections can be applied to machinery, aerospace and military fields. In particular, this controller can be used to track and attack enemy flying objects through the active control. It is important to ensure reliability of the driving controller since its operation should be kept with precision to the target point. The temperature of the environment where the driving controller is used is about -32 C ~ 50 C (241~323 ). Heat generated in the driving controller should be maintained below a certain threshold (85 C (358 )) to ensure reliability; therefore, the study and analysis of the heat flow characteristics in the driving controller are required. In this research, commercial software Solid-Works Flow Simulation was used for the numerical simulation assuming a low Reynolds number turbulence model and an incompressible viscous flow. The goal of this paper is to design the driving controller safely by analyzing the characteristics of the heat flow inside of the controller composed of chips or boards. Our analysis shows temperature distributions for boards and chips below a certain threshold.

능동 파괴 방호 구동제어기는 기계, 항공 및 군사 분야 등에서 사용될 수 있는 제어기로서, 상대의 비행물체를 능동제어를 통해 추적 타격하는데 사용된다. 구동제어기를 이용하여 목표지점까지의 정밀도를 갖고 동작이 유지되어야 하기 때문에, 이에 대한 신뢰성 확보가 대단히 중요하다. 이러한 구동제어기가 사용되는 주위 환경의 온도는 약 $-32^{\circ}C{\sim}50^{\circ}C$($241^{\circ}K{\sim}358^{\circ}K$)이다. 신뢰성을 갖기 위해 구동제어기에서 중요시 간주되는 문제 중의 하나는 구동제어기 내의 열 발생이 어느 한계수준($85^{\circ}C$($358^{\circ}K$))이하로 유지되어야 정밀도와 신뢰성을 확보할 수 있다는 점이다. 따라서 구동제어기 내의 열 유동특성에 대한 연구와 분석이 필요하게 된다. 본 논문의 수치시뮬레이션을 위해 저 레이놀드 수 $k-{\epsilon}$ 난류모델과 비압축성 점성 유동을 가정하였고, 상용 소프트웨어인 Solid-Works Flow Simulation을 사용하였다. 본 논문의 목적은 각종 칩이나 보드 등을 갖는 구동제어기 내부의 열 유동 특성을 해석하여 구동제어기의 안전한 설계를 하는데 있다. 해석으로부터, 보드들과 칩들의 온도분포가 어떤 한계 수준 이내에 있음을 보여준다.

Keywords

References

  1. W. P. Jones and B. E. Launder, "The calculation of low-Reynolds-number phenomena with a two-equation model of turbulence", Int. J. Heat and Mass Transfer. vol. 16, pp. 1119-1130, 1973. DOI: https://doi.org/10.1016/0017-9310(73)90125-7
  2. T. Fusegi, J. M. Hyun, K. Kuwahara, and B. Farouk, "A Numerical Study of Three-Dimensional Natural Convection in a Deferentially Heated Cubical Enclosure", International Journal of Heat and Mass Transfer, vol. 34, no. 6, pp. 1543-1557, 1991. https://doi.org/10.1016/0017-9310(91)90295-P
  3. J. Pallares, I. Cuesta, F. X. Grau and G. Francesc, "Natural Convection in a Cubical Cavity Heated from Below at Low RayLeigh Numbers", International Journal of Heat and Mass Transfer, vol. 39, no. 15, pp. 3233-3247, 1996. DOI: http://dx.doi.org/10.1016/0017-9310(95)00390-8
  4. J. H. Lee, S. H. Lee, H. J. Lim and K. W. Park, "Flow/Heat Transfer Analysis and Shape Optimization of a Heat Exchanger with Internally Finned Tube", Transactions of the Korean Society of Mechanical Engineers, vol. 29B, no. 4, pp. 460-468, 2005. http://www.dbpia.co.kr/Article/NODE00586751
  5. J. J. Nelson, G. Venkataramanan, and A. M. El-Refaie, "Fast thermal profiling of power semiconductor devices using Fourier techniques", IEEE Transactions on industrial Electronics, vol. 53, no. 2, pp. 521-529, 2006. DOI: https://doi.org/10.1109/TIE.2006.870714
  6. Z. Gao, T. G. Habetler, R. G. Harley, and R. S. Colby, "A sensorless rotor temperature estimator for induction machines based on a current harmonic spectral estimation scheme", IEEE Transactions on industrial Electronics, vol. 55, no. 1, pp. 407-416, 2008. DOI: https://doi.org/10.1109/TIE.2007.896282
  7. D. A. Staton and A. Cavagnino, "Convection Heat Transfer and Flow Calculations Suitable for Electric Machines Thermal Models", IEEE Transactions on industrial Electronics, vol. 55, no. 10, pp. 3509-3516, 2008. DOI: https://doi.org/10.1109/TIE.2008.922604
  8. C. Han, K. N. Ha and I. S. Eo, "Heat Analysis of 50W LED Lighting Fixtures", Proceedings of the Summer Conference of The Korean Institute of Electrical Engineers, pp. 1607-1608, 2010. http://www.dbpia.co.kr/Article/NODE01534522
  9. J. H. Kim, J. G. Lee, K. S. Lee, W. Rhee and H. B. Lee, "Thermal Fluid Flow Analysis for Temperature Characterization of Mold Transformer in Distribution Power System", The Transactions of the Korean Institute of Electrical Engineers, vol. 62P, no. 1, pp. 6-11, 2013. DOI: http://doi.org/10.5370/KIEEP.2013.62.1.006
  10. Dassault system, "Technical Reference SOLIDWORKS Flow Simulation 2015," Dassault System Corp., 2015.