Reliability Evaluation of Atomic layer Deposited Polymer / Al2O3 Multilayer Film for Encapsulation and Barrier of OLEDs in High Humidity and Temperature Environments

OLED Barrier와 Encapsulation을 위한 원자층 증착 Polymer / Al2O3 다층 필름의 온습도 신뢰도 평가 분석

  • Received : 2017.10.11
  • Accepted : 2017.12.26
  • Published : 2017.12.31

Abstract

Encapsulation of organic based devices is essential issue due to easy deterioration of organic material by water vapor. Atomic layer deposition (ALD) is a promising solution because of its low temperature deposition and quality of the deposited film. Moisture permeation has a mechanism to pass through defects, Thin Film Encapsulation using inorganic / organic / inorganic hybrid film has been used as promising technology. $Al_2O_3$ / Polymer / $Al_2O_3$ multilayer film has shown excellent environmental protection characteristics despite of thin thicknesses of the films.

Keywords

References

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