Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Aluminum Brazing and Its Principle

알루미늄의 브레이징과 원리

  • Lee, Soon-Jae (Department of Materials Science and Engineering, University of Seoul) ;
  • Jung, Do-Hyun (Department of Materials Science and Engineering, University of Seoul) ;
  • Jung, Jae-Pil (Department of Materials Science and Engineering, University of Seoul)
  • 이순재 (서울시립대학교 신소재공학과) ;
  • 정도현 (서울시립대학교 신소재공학과) ;
  • 정재필 (서울시립대학교 신소재공학과)
  • Received : 2017.11.01
  • Accepted : 2017.11.21
  • Published : 2017.12.31
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Abstract

Aluminum alloys have been widely used in many fields such as electronic, structure, aero-space and vehicle industries due to their outstanding thermal and electrical conductivity as well as low cost. However, they have some difficulties for using in brazing process because of the strong oxide layer of $Al_2O_3$ on the surface of Al alloy. In addition, their melting point is similar to that of brazing filler metal resulting in thermal damage of Al alloys. Therefore, it is very important to understand the brazing principles, filler metal and its properties such as wetting, capillary flow and dissolution of base metal in the Al brazing process. This paper reviews the brazing principles, aluminum alloys, and brazing fillers. In the case of brazing principle, some formula was used for calculation of capillary force and the dissolution to obtain the best condition of Al brazing. In addition, the advanced research trends in Al brazing were introduced including thermal treatment, additive for improving property and decreasing melting point in Al brazing process.

Keywords

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