DOI QR코드

DOI QR Code

Surface Micromachined Pressure Sensor with Internal Substrate Vacuum Cavity

  • Je, Chang Han (ICT Materials & Components Research Laboratory, ETRI) ;
  • Choi, Chang Auck (ICT Materials & Components Research Laboratory, ETRI) ;
  • Lee, Sung Q (ICT Materials & Components Research Laboratory, ETRI) ;
  • Yang, Woo Seok (ICT Materials & Components Research Laboratory, ETRI)
  • 투고 : 2015.07.30
  • 심사 : 2016.04.28
  • 발행 : 2016.08.01

초록

A surface micromachined piezoresistive pressure sensor with a novel internal substrate vacuum cavity was developed. The proposed internal substrate vacuum cavity is formed by selectively etching the silicon substrate under the sensing diaphragm. For the proposed cavity, a new fabrication process including a cavity side-wall formation, dry isotropic cavity etching, and cavity vacuum sealing was developed that is fully CMOS-compatible, low in cost, and reliable. The sensitivity of the fabricated pressure sensors is 2.80 mV/V/bar and 3.46 mV/V/bar for a rectangular and circular diaphragm, respectively, and the linearity is 0.39% and 0.16% for these two diaphragms. The temperature coefficient of the resistances of the polysilicon piezoresistor is 0.003% to 0.005% per degree of Celsius according to the sensor design. The temperature coefficient of the offset voltage at 1 atm is 0.0019 mV and 0.0051 mV per degree of Celsius for a rectangular and circular diaphragm, respectively. The measurement results demonstrate the feasibility of the proposed pressure sensor as a highly sensitive circuit-integrated pressure sensor.

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참고문헌

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