References
- Z. G. Chen, Chinese Materials Research Society, 22, 535 (2012).
- K. H. Lee, J. Y. Kim, and S. M. Choi, Journal of the Korean Ceramic Society, 52, 1 (2014).
- H. J. Goldsmid, CRC Handbook of Thermoelectrics (ed., D. M. Rowe) (CRC Press, USA, 1995) p. 19.
- G. S. Nolas, D. T. Morelli, and T. M. Tritt, Annual Review of Materials Science, 29, 94 (1999).
- G. A. Slack, CRC Handbook of Thermo-electrics (eds. M. Rowe) (CRC Press, USA, 1995).
- S. I. Kim and K. H. Lee, Science, 348, 109 (2015). [DOI: http://dx.doi.org/10.1126/science.aaa4166]
- H. J. Goldsmid and A. W. Penn, Phys. Lett., 27A, 523 (1968). [DOI: http://dx.doi.org/10.1016/0375-9601(68)90898-0]
- J. R. Sootsman, D. Y. Chung, and M. G. Kanatzidis, International Edition, 48, 8616 (2009). [DOI: http://dx.doi.org/10.1002/anie.200900598]
- J. Y. Cho, Acta Materialia, 60, 2104 (2012). [DOI: http://dx.doi.org/10.1016/j.actamat.2011.12.022]
- R. Liu, J. Mater. Res., 26, 1813 (2011). https://doi.org/10.1557/jmr.2011.85
- X. F. Tang, J. Mater. Res., 17, 2953 (2002). https://doi.org/10.1557/JMR.2002.0428
- G. S. Nolas, Phy. Rev. B, 58, 164 (1998). https://doi.org/10.1103/PhysRevB.58.164
- C. Zhou, Intermetallics, 19, 1390 (2011). [DOI: http://dx.doi.org/10.1016/j.intermet.2011.04.015]
- J. P. Fleurial, Proc. 15th International Conference on Thermoelectrics (California, USA, 1996). [DOI: http://dx.doi.org/10.1109/ict.1996.553263]
- R. Liu, Intermetallics, 19, 1747 (2011). [DOI: http://dx.doi.org/10.1016/j.intermet.2011.06.010]
- S. Q. Bai, Y. Z. Pei, and L. D. Chen, Acta Materialia, 57, 3135 (2009). [DOI: http://dx.doi.org/10.1016/j.actamat.2009.03.018]
- J. Yang, W. Zhang, S. Q. Bai, Z. Mei, and L. D. Chen, Appl. Phys. Lett., 90, 1 (2007).
- L. Zhou, Intermetallics, 32, 209 (2013). [DOI: http://dx.doi.org/10.1016/j.intermet.2012.08.005]
- G. Rogl, Intermetallics, 18, 57 (2010). [DOI: http://dx.doi.org/10.1016/j.intermet.2009.06.005]
- G. Rogl, Intermetallics, 19, 546 (2011). [DOI: http://dx.doi.org/10.1016/j.intermet.2010.12.001]
- G. Rogl, Acta Materialia, 61, 6778 (2013). [DOI: http://dx.doi.org/10.1016/j.actamat.2013.07.052]
- G. Rogl, Intermetallics, 18, 2435 (2010). [DOI: http://dx.doi.org/10.1016/j.intermet.2010.08.041]
- J. Yu, J. Electron. Mater., 41, 1414 (2012). https://doi.org/10.1007/s11664-012-2029-2
- G. Tan, J. Alloy. Compd., 513, 328 (2012). [DOI: http://dx.doi.org/10.1016/j.jallcom.2011.10.042]
- G. Rogl, Acta Materialia, 76, 434 (2014). [DOI: http://dx.doi.org/10.1016/j.actamat.2014.05.051]
- G. J. Tan, J. Electron. Mater., 41, 434 (2012).
- C. Zhou, J. Electron. Mater., 41, 1030 (2012). https://doi.org/10.1007/s11664-011-1831-6