Journal of Powder Materials (한국분말재료학회지)

The Korean Powder Metallurgy & Materials Institute (한국분말재료학회 (*구 분말야금학회))
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Investigation on Microstructure and Electrical Properties of Silver Conductive Features Using a Powder Composed of Silver nanoparticles and Nanoplatelets

은 나노입자-나노플레이트 혼합 분말로 형성된 은 전도성 배선의 미세조직 및 전기적 특성 연구

  • Goo, Yong-Sung (Department of Fusion Chemical Engineering, Hanyang University) ;
  • Choa, Yong-Ho (Department of Fusion Chemical Engineering, Hanyang University) ;
  • Hwangbo, Young (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Lee, Young-In (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
  • 구용성 (한양대학교 융합화학공학과) ;
  • 좌용호 (한양대학교 융합화학공학과) ;
  • 황보영 (서울과학기술대학교 신소재공학과) ;
  • 이영인 (서울과학기술대학교 신소재공학과)
  • Received : 2016.08.17
  • Accepted : 2016.09.29
  • Published : 2016.10.28
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Abstract

Noncontact direct-printed conductive silver patterns with an enhanced electrical resistivity are fabricated using a silver ink with a mixture of silver nanoparticles and nanoplates. The microstructure and electrical resistivity of the silver pattern are systematically investigated as a function of the mixing ratio of the nanoparticles and nanoplates. The pattern, which is fabricated using a mixture with a mixing ratio of 3(nanoparticles):7(nanoplates) and sintered at $200^{\circ}C$ shows a highly dense and well-sintered microstructure and has a resistivity of $7.60{\mu}{\Omega}{\cdot}cm$. This originates a mutual synergistic effect through a combination of the sinterability of the nanoparticles and the packing ability of the nanoplates. This is a conductive material that can be used to fabricate noncontact direct-printed conductive patterns with excellent electrical conductivity for various flexible electronics applications, including solar cells, displays, RFIDs, and sensors.

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