Applied Microscopy

Korean Society of Microscopy (한국현미경학회)
권호 표지
DOI QR코드

DOI QR Code

Cross-Sectional Transmission Electron Microscopy Sample Preparation of Soldering Joint Using Ultramicrotomy

  • Bae, Jee-Hwan (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Kwon, Ye-Na (School of Advanced Materials Science and Engineering, Sungkyunkwan University) ;
  • Yang, Cheol-Woong (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
  • Received : 2016.09.26
  • Accepted : 2016.09.26
  • Published : 2016.09.30
Download PDF
⟨ Previous Next ⟩

Abstract

Solder/electroless nickel immersion gold (ENIG) joint sample which is comprised of dissimilar materials with different mechanical properties has limited the level of success in preparing thin samples for transmission electron microscopy (TEM). This short technical note reports the operation parameters for ultramicrotomy of solder joint sample and TEM analysis results. The solder joint sample was successfully sliced to 50~70 nm thick lamellae at slicing speed of 0.8~1.2 mm/s using a boat-type $45^{\circ}$ diamond knife. Ultramicrotomy can be applied as a routine sample preparation technique for TEM analysis of solder joints.

Keywords

References

  1. Becker O and Bange K (1993) Ultramicrotomy: an alternative cross sections preparation for oxidic thin films on glass. Ultramicroscopy 52, 73-84. https://doi.org/10.1016/0304-3991(93)90023-Q
  2. Glanvill S R (1995) Ultramicrotomy of semiconductors and related materials. Microsc. Res. Tech. 31, 275-284. https://doi.org/10.1002/jemt.1070310404
  3. Howell D A, Heckman J R, and Crimp M A (1995) Preparation of metal multilayer TEM cross-section using ultramicrotomy. J. Microsc. 180, 182-185. https://doi.org/10.1111/j.1365-2818.1995.tb03674.x
  4. Hwang C W and Suganuma K (2003) Interface microstructures between Ni-P plating and Sn-Ag-(Cu) lead-free solders. J. Mater. Res. 18, 2540-2543. https://doi.org/10.1557/JMR.2003.0354
  5. Kang H B, Lee J W, Bae J H, Park M H, Yoon J W, Jung S B, Ju J S, and Yang C W (2008) Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system. J. Mater. Res. 23, 2195-2201. https://doi.org/10.1557/JMR.2008.0266
  6. Kang H B, Bae J H, Yoon J W, Jung S B, Park J, and Yang C W (2011) Microstructure of interfacial reaction layer in Sn-Ag-Cu/electroless Ni (P) solder joint. J. Mater. Sci.: Mater. Electron. 22, 1308-1312. https://doi.org/10.1007/s10854-011-0305-1
  7. Quintana C (1997) Ultramicrotomy for cross-sections of nanostructure. Micron 28, 217-219. https://doi.org/10.1016/S0968-4328(97)00023-1