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그래핀을 이용한 전자패키징 기술 연구 동향

Trends of Researches and Technologies of Electronic Packaging Using Graphene

  • 고용호 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 최경곤 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 김상우 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 유동열 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 방정환 (한국생산기술연구원 마이크로조이닝센터/용접접합그룹) ;
  • 김택수 (한국과학기술원 기계공학과)
  • Ko, Yong-Ho (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Choi, Kyeonggon (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Kim, Sang Woo (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Yu, Dong-Yurl (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Bang, Junghwan (Micro-Joining Center/Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) ;
  • Kim, Taek-Soo (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
  • 투고 : 2016.05.20
  • 심사 : 2016.06.03
  • 발행 : 2016.06.30

초록

This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

키워드

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