한국분말재료학회지 (Journal of Powder Materials)

  • 제23권2호
  • /
  • Pages.132-135
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  • 2016
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  • 2799-8525(pISSN)
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  • 2799-8681(eISSN)
한국분말재료학회 (*구 분말야금학회) (The Korean Powder Metallurgy & Materials Institute)
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NFC의 자기차폐용 Ni-Zn-Cu 페라이트의 자기특성에 미치는 소결온도의 영향

Influence of Sintering Temperature on Magnetic Properties of Ni-Zn-Cu Ferrites Used for Mangetic Shielding in NFC

  • 류요한 (충북대학교 신소재공학과) ;
  • 김성수 (충북대학교 신소재공학과)
  • Ryu, Yo-Han (Department of Advanced Materials Engineering, Chungbuk National University) ;
  • Kim, Sung-Soo (Department of Advanced Materials Engineering, Chungbuk National University)
  • 투고 : 2015.11.11
  • 심사 : 2015.12.16
  • 발행 : 2016.04.28
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초록

This study investigates the influence of sintering temperature on the magnetic properties and frequency dispersion of the complex permeability of Ni-Zn-Cu ferrites used for magnetic shielding in near-field communication (NFC) systems. Sintered specimens of $(Ni_{0.7}Zn_{0.3})_{0.96}Cu_{0.04}Fe_2O_4$ are prepared by conventional ceramic processing. The complex permeability is measured by an RF impedance analyzer in the range of 1 MHz to 1.8 GHz. The real and imaginary parts of the complex permeability depend sensitively on the sintering temperature, which is closely related to the microstructure, including grain size and pore distribution. In particular, internal pores within grains produced by rapid grain growth decrease the permeability and increase the magnetic loss at the operating frequency of NFC (13.56 MHz). At the optimized sintering temperature ($1225-1250^{\circ}C$), the highest permeability and lowest magnetic loss can be obtained.

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참고문헌

  1. J. Fisher: IEEE Commun. Mag., 47 (2009) 22.
  2. R. Want: IEEE Pervasive Comput., 10 (2011) 4.
  3. B. Lee, B. Kim and S. Yang: Inter. J. Antennas Propag., 2014 (2014) 187029.
  4. X. Shen, Y. Wang, X. Yang, L. Lu and L. Huang: J. Mater. Sci. Mater. Electron., 21 (2010) 630. https://doi.org/10.1007/s10854-009-9968-2
  5. J. K. Ji, W. K. Ahn, J. S. Kum, S. H. Park, G. H. Kim and W. M. Seong: IEEE Magn. Lett., 1 (2010) 5000104. https://doi.org/10.1109/LMAG.2009.2038580
  6. K. Chen, L. Jia, X. Yu and H. Zhang: J. Appl. Phys., 115 (2014) 17A520. https://doi.org/10.1063/1.4866517
  7. S. Bae, Y. K. Hong, J. J. Lee, W. M. Seong, W. M. Kum, J. S. Ahn, W. K. Park and S. H. Park: IEEE Trans. Magn., 46 (2010) 2361. https://doi.org/10.1109/TMAG.2010.2044376
  8. J. J. Shrotri, S. D. Kulkarni, C. E. Deshpande, A. Mitra, S. R. Sainkar, P. S. A. Kumar and S. K. Date: Mater. Chem. Phys., 59 (1999) 1. https://doi.org/10.1016/S0254-0584(99)00019-X
  9. H. Su, H. Zhang, X. Tang and X. Xiang: J. Magn. Magn. Mater., 283 (2004) 157. https://doi.org/10.1016/j.jmmm.2004.05.017
  10. T. T. Ahmed, I. Z. Rahman and M. A. Rahman: J. Mater. Process. Technol., 153 (2004) 797.