마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제23권4호
  • /
  • Pages.49-55
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  • 2016
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Magnetic and Thermal Evaluation of a Magnetic Tunneling Junction Current Sensor Package

  • Rhod, Eduardo (Electrical Engineering Graduate Program, Unisinos University) ;
  • Peter, Celso (Electrical Engineering Graduate Program, Unisinos University) ;
  • Hasenkamp, Willyan (Electrical Engineering Graduate Program, Unisinos University) ;
  • Grion, Agner (Science and Technology Foundation-CIENTEC)
  • 투고 : 2016.12.05
  • 심사 : 2016.12.23
  • 발행 : 2016.12.31
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초록

Nowadays there are magnetic sensors in a wide variety of equipment such as computers, cars, airplanes, medical and industrial instruments. In many of these applications the magnetic sensors offer safe and non-invasive means of detection and are more reliable than other technologies. The electric current in a conductor generates a magnetic field detected by this type of sensor. This work aims to define a package dedicated to an electrical current sensor using a MTJ (Magnetic Tunnel Junction) as a sensing device. Four different proposals of packaging, three variations of the chip on board (CoB) package type and one variation of the thin small outline package (TSOP) were analyzed by COMSOL modeling software by simulating a brad range of current injection. The results obtained from the thermal and magnetic analysis has proven to be very important for package improvements, specially for heat dissipation performance.

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참고문헌

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