References
- T. Watanabe, T. Kitabayashi, Effect of additives on the electrostatic force of alumina electrostatic chucks, J. Ceramic Soc. Jpn., 100(1) (1992) 1-6. https://doi.org/10.2109/jcersj.100.1
- L. D. Hartsough, Electrostatic Wafer Holding, Solid state Tech. 36(1) (1993) 87-91.
- S. A. Khomyakov, Attraction and Accuracy Characteristics of Electrostatic Chucks, Machines and Tooling, 50 (1979) 22-24.
- The Institute of Electrostatics Japan, Hand Book of Electrostatics (1981) 672-675.
- J. Yoo, J. S. Choi, S. J. Hong, T. H. Kim, S. J. Lee, Proceedings of International Conference on Electrical Machines and Systems, Seoul (2007).
- C. Balaskrishnan, Johnsen-Rahbek Effect with an Electronic Semi-Conductor, Br. J. Appl. Phys., 1(8) (1950) 211-213. https://doi.org/10.1088/0508-3443/1/8/304
- R. Atkinson, A Simple Theory of the Johnsen-Rahbek Effect, Br. J. Appl. Phys., 2(3) (1969) 325.
- T. Watanabe, T. Kitabayashi, C. Nakayama, Relationship Between Electrical Resistivity and Electrostatic Force of Alumina Electrostatic Chuck, Jpn. J. Appl. Phys., 32(2R) (1993) 864. https://doi.org/10.1143/JJAP.32.864
- V. P. Singh, A. Sil, R. Jayaganthan, A study on sliding and erosive wear behavior of atmospheric plasma sprayed conventional and nanostructured alumina coatings, materials & Design, 32(2) (2011) 584-591. https://doi.org/10.1016/j.matdes.2010.08.019
- X. Q. Cao, R. Vassen, S. Schwartz, W. Jungen, F. Tietz, D. Stoever, Spray-drying of ceramics for plasma-spray coating, J. Eur. Ceram. Soc., 20(14) (2000) 2433-2439. https://doi.org/10.1016/S0955-2219(00)00112-6
- G. I. Shim, T. Yamauchi, H. Sugai, Plasma effects on electrostatic chuck characteristics on capacitive RF discharge, Plasma and Fusion Research, 2 (2007) 044-044. https://doi.org/10.1585/pfr.2.044
- M. Nakasuji, H. Shimizn, Low voltage and high speed operating electrostatic wafer chuck, J. Vac. Sci. Technol. A, 10(6) (1992) 3573-3578. https://doi.org/10.1116/1.577786
- J. H. Kim, S. H. Yoon, H. T. Na, C. H. Lee, Microstructure and tribological properties along with chemical composition and size of initial powder in Fe-based BMG coating through APS, J. Korean Inst. Surf. Eng., 41(5) (2008) 220-225. https://doi.org/10.5695/JKISE.2008.41.5.220
- K. Yatsuzuka, F. Hatakeyama, K. Asano, S. Aonuma, Fundamental characteristics of electrostatic wafer chuck with insulating sealant, IEEE Trans. Ind. Appl., 36(2) (2000) 510-516. https://doi.org/10.1109/28.833768
- T. Gumula, C. Paluszkiewicz, M. Blazewicz, Structural characterization of polysiloxane-derived phases produced during heat treatment, J. Mol. Struct., 704(1) (2004) 259-262. https://doi.org/10.1016/j.molstruc.2003.12.064
- F. Bauer, U. Decker, A. Dierdorf, H. Ernst, R. Heller, H. Liebe, R. Mehnert, Preparation of moisture curable polysilazane coatings: Part I. Elucidation of low temperature curing kinetics by FT-IR spectroscopy, Pro. Org., 53(3) (2005) 183-190. https://doi.org/10.1016/j.porgcoat.2005.02.006
- O. Funayama, Y. Tashiro, A. Kamo, M. Okumura, T. Isoda, Conversion mechanism of perhydropolysilazane into silicon nitride-based ceramics, J. Mater. Sci. 29(18) (1994) 4883-4888. https://doi.org/10.1007/BF00356538
- A. Agarwal, T. McKechnie, S. Seal, Net shape nanostructured aluminum oxide structures fabricated by plasma spray forming, J. Therm. Spray Technol., 12(3) (2003) 350-359. https://doi.org/10.1361/105996303770348221