Abstract
Owing to the introduction of various IT devices with emphasis on portability and design, the TFT (thin film transistor liquid crystal display) panel applied to IT devices has the same shape as the product, and the portability requirement of IT devices has resulted in a need for panels with higher rigidity. In this study, the effect of grinding conditions such as the feed rate and edge speed of edge grinding on the surface roughness and chipping of the machined surface is investigated using a metal bond wheel. During edge grinding of alkari-free glass, weak mechanical property of glass results in big chipping owing to generation of tensile stress at the end of grining operation. The results of this study show that the grinding characteristics of alkali-free glass are obtained and meet industry requirements.
