Korean Journal of Optics and Photonics (한국광학회지)

Optical Society of Korea (한국광학회)
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Thermal Characteristics of a Heat Sink with Bypass Structure for GaN-based Laser Diode

열 우회 구조를 적용한 GaN 레이저 다이오드 패키지의 열특성 분석

  • Ji, Byeong-Gwan (School of Information and Communication Engineering, Inha University) ;
  • Lee, Seung-Gol (School of Information and Communication Engineering, Inha University) ;
  • Park, Se-Geun (School of Information and Communication Engineering, Inha University) ;
  • O, Beom-Hoan (School of Information and Communication Engineering, Inha University)
  • 지병관 (인하대학교 정보통신공학과) ;
  • 이승걸 (인하대학교 정보통신공학과) ;
  • 박세근 (인하대학교 정보통신공학과) ;
  • 오범환 (인하대학교 정보통신공학과)
  • Received : 2016.06.21
  • Accepted : 2016.10.11
  • Published : 2016.12.25
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Abstract

The thermal characteristics of a laser diode TO package has been analyzed using a commercial computational fluid dynamics (CFD) tool, and the thermal bypass structure was optimized. Comparison of device temperature and the estimated thermal resistance of the resultant structure showed that the bypass structure relieved the thermal bottleneck, and improved the thermal characteristics quite efficiently.

레이저 다이오드 TO 패키지 내부의 주요 부분과 히트싱크 구조의 열전달 특성을 전산모사를 통해 분석하고, 개선구조의 효율적 적용방안을 제안하였다. 열 병목 현상을 개선하기 위해, 레이저 다이오드 상부에 열 우회를 도모할 수 있는 방열구조물을 설치하는 것을 제안하였고, 열저항 단순모델 기대치와 비교하여 그 우회 효율 개선 정도를 더욱 향상시키는 적용 범위를 파악하였다. 열 병목을 감안하여 방열 도움 구조물을 적절히 추가함에 따라, 통상적인 기대 수준보다 더욱 향상된 열 우회 효율을 얻을 수 있었음을 보고한다.

Keywords

References

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