ETRI Journal

  • 제37권3호
  • /
  • Pages.523-532
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  • 2015
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  • 1225-6463(pISSN)
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  • 2233-7326(eISSN)
한국전자통신연구원 (Electronics and Telecommunications Research Institute)
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HV-SoP Technology for Maskless Fine-Pitch Bumping Process

  • Son, Jihye (Components & Materials Research Laboratory, ETRI) ;
  • Eom, Yong-Sung (Components & Materials Research Laboratory, ETRI) ;
  • Choi, Kwang-Seong (Components & Materials Research Laboratory, ETRI) ;
  • Lee, Haksun (Components & Materials Research Laboratory, ETRI) ;
  • Bae, Hyun-Cheol (Components & Materials Research Laboratory, ETRI) ;
  • Lee, Jin-Ho (Components & Materials Research Laboratory, ETRI)
  • 투고 : 2014.05.13
  • 심사 : 2015.01.17
  • 발행 : 2015.05.01
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초록

Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

키워드

참고문헌

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피인용 문헌

  1. Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection vol.22, pp.2, 2015, https://doi.org/10.6117/kmeps.2015.22.2.055
  2. Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding vol.38, pp.6, 2015, https://doi.org/10.4218/etrij.16.0115.0945
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