References
- S. R. Forrest, Nature 428, 911 (2004). https://doi.org/10.1038/nature02498
- K. Jain, M. Klosner, M. Zemel, S. Raghunandan, Proc. IEEE 93, 1500 (2005). https://doi.org/10.1109/JPROC.2005.851505
- K. J. Allen, Proc. IEEE 93, 1394 (2005). https://doi.org/10.1109/JPROC.2005.851511
- T.Sekitani, U. Zschieschang, H. Klauk, T. Someya, Nature Materials 9, 10151022 (2010).
- US patent, US8804349 (2014).
- K. Nomura, H. Ohta, A. Takahi, T. Kamiya, M. Hirano & H. Hosono, Nature 432, 488 (2004). https://doi.org/10.1038/nature03090
- T. Kamiya, K. Nomura, H. Hosono, Sci. Technol. Adv. Mater. 11, 044305 (2010). https://doi.org/10.1088/1468-6996/11/4/044305
- J. Yoo et al., SID Digest 65.1, 962 (2015).
- Y. Yuan et al., Nature Communications 5, 3005 (2014). https://doi.org/10.1038/ncomms4005
- H. Moon et al., Nature Mateirals 14, 628 (2015). https://doi.org/10.1038/nmat4237
- M. Kaltenbrunner et al., Nature 499, 458 (2013). https://doi.org/10.1038/nature12314