Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Numerical Analysis of the Filling Stage in Insert Injection Molding of Microfluidic Chip with Metal Electrodes

금속 전극을 포함한 미세유체 칩의 인서트 사출성형 충전 공정 해석

  • Lee, Bong-Kee (School of Mechanical Engineering, Chonnam National University) ;
  • Na, Seung-Sik (School of Mechanical Engineering, Chonnam National University)
  • 이봉기 (전남대학교 기계공학부) ;
  • 나승식 (전남대학교 기계공학부)
  • Received : 2015.07.29
  • Accepted : 2015.09.02
  • Published : 2015.11.01
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Abstract

In the present study, a numerical investigation of an insert injection molding process was carried out for the development of thermoplastic microfluidic chip plates with metal electrodes. Insert injection molding technology enables efficient realization of a plastic-metal hybrid structure and various efforts have been undertaken to produce novel components in several application fields. The microfluidic chip with metal inserts was proposed as a representative example and its molding process was analyzed. The important characteristics of the filling stage, such as the effects of filling time and thickness of the part cavity, were characterized. Furthermore, the detailed distributions of pressure and temperature at the end of the filling stage were investigated, revealing the significance of metal insert temperature.

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References

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