Journal of computational fluids engineering (한국전산유체공학회지)

Korean Society of Computational Fluids Engineering (한국전산유체공학회)
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ANALYSIS OF HEAT TRANSFER PERFORMANCE WITH ASPECT AND FILLING RATIOS IN THERMOSYPHON

열사이펀의 형상비와 충전율에 따른 열전달 성능 해석

  • Kim, Y.C. (Dept. of Aerospace Engineering, Graduate School, Sunchon National Univ.) ;
  • Choi, J.W. (School of Mechanical and Aerospace Engineering, Sunchon National Univ.) ;
  • Kim, S.C. (School of Mechanical and Aerospace Engineering, Sunchon National Univ.)
  • 김영철 (순천대학교 대학원 우주항공공학과) ;
  • 최종욱 (순천대학교 기계우주항공공학부) ;
  • 김성초 (순천대학교 기계우주항공공학부)
  • Received : 2015.01.30
  • Accepted : 2015.03.24
  • Published : 2015.03.31
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Abstract

Thermal-fluid analysis is performed numerically to figure out the characteristics of heat transfer in a thermosyphon varying with the aspect ratio of geometry and the filling ratio of working fluid. The computational results are reasonable compared with the experimental data and visualized. The thermal resistance and the convective heat transfer coefficients are evaluated with the aspect ratio of thermosyphon and the filling ratio of working fluid, respectively. In conclusion, the thermal resistance decreases as the length of evaporator increases. However, the variation of a condenser length is nearly independent on the thermal resistance. In order to raise the performance of thermosyphon, the working fluid needs to be filled over 75%. In addition, Nusselt numbers in the evaporator and the condenser show 275 and 304, respectively.

Keywords

References

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