References
- H. Grassl, J. Kokott, M. Kulessa, J. Luther, F. Nuscheler, R. Sauerborn, H. J. Schellnhuber, R. Schubert, and E. D. Schulze, WBGU (German Advisory Council on Global Change) Berlin Special Report (2003).
- A. Rose, Physica Status Solidi. A, 56, 11 (1979). https://doi.org/10.1002/pssa.2210560102
- J. M. Pearce, Futures, 34, 663 (2002). https://doi.org/10.1016/S0016-3287(02)00008-3
- R. Lathrop and K. Pfluke, Published in the proceedings of the 26th European Union Photovoltaic Solar Energy Conference, 5 (2011).
- T. S. Cho, C. S. Cho, and M. S. Chae, Trans. Electr. Electron. Mater., 15, 217 (2014). https://doi.org/10.4313/TEEM.2014.15.4.217
- T. S. Cho and C. S. Cho, Trans. Electr. Electron. Mater., 16, 20 (2015). https://doi.org/10.4313/TEEM.2015.16.1.20
- J. S. Jeong, N. Park, and C. Han, Microelectronics Reliability, 52, 2326 (2012). https://doi.org/10.1016/j.microrel.2012.06.027
- M. A. Quintana, D. L. King, T. J. McMahon, and C. R. Osterwald, Photovoltaic Specialists Conference, 1436 (2002).
- J. Wendt, M. Trager, R. Klengel, M. Petzold, D. Schade, and R. Sykes, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2010 12th IEEE Intersociety Conference, 1 (2010).
- M. Schaefer, R. A. Fournelle, and J. Liang, Journal of Electronic Materials, 27, 1167 (1998). https://doi.org/10.1007/s11664-998-0066-7
- S. Choi, T. R. Bieler, K. N. Subramanian, and J. P. Lucas, Soldering & Surface Mount Technology, 13, 26 (2001). https://doi.org/10.1108/09540910110385220
- W. B. Hampshire, Soldering & Surface Mount Technology, 5, 49 (1993). https://doi.org/10.1108/eb037826
- C. Y. Liu, C. Chan, and K. N. Tu, J. of Applied Physics, 88, 5703 (2000). https://doi.org/10.1063/1.1319327
- J. H. Lee, Y. H. Lee, and Y. S. Kim, Scripta Materialia, 42, 789 (2000). https://doi.org/10.1016/S1359-6462(99)00431-5
- P. Schmitt, P. Kaiser, C. Savio, M. Tranitz, and U. Eitner, Energy Procedia, 27, 664 (2012).
- Q. Ran, H. L. Lukas, and V. lvanchenko, Landolt-Bornstein - Group IV Physical Chemistry, 11C3, 113 (2007). https://doi.org/10.1007/978-3-540-47004-5_14
- Y. R. Luo and J. A. Kerr, CRC Handbook of Chemistry and Physics, 89 (2012).
- Y. R. Luo, Comprehensive Handbook of Chemical Bond Energies (CRC Press, Boca Raton 2007) p. 475.
- W. D. Callister and D. G. Rethwisch, Materials Science and Engineering: an Introduction, 7th ed (John Wiley & Sons, New York, 2007) p. 278.
- K. Y. Lee, M. Li, D. R. Olsen, and W. T. Chen, 2001 Electronic Components and Technology Conference, 478 (2001).
Cited by
- Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test vol.10, pp.4, 2017, https://doi.org/10.3390/en10040529