A study on the strip layout design of smart phone main board cover using reverse engineering

역설계를 이용한 스마트폰 메인보드 커버의 스트립 레이아웃 설계에 관한 연구

  • Choi, Young-Rock (Department of Metalmold Design Engineering, Kongju National University) ;
  • Kim, Dong-Wook (Department of Metalmold Design Engineering, Kongju National University) ;
  • Kim, Sei-Hwan (Department of Metalmold Design Engineering, Kongju National University) ;
  • Choi, Kyu-Kwang (Department of Metalmold Design Engineering, Kongju National University)
  • 최영락 (공주대학교 금형설계공학과) ;
  • 김동욱 (공주대학교 금형설계공학과) ;
  • 김세환 (공주대학교 금형설계공학과) ;
  • 최계광 (공주대학교 금형설계공학과)
  • Accepted : 2015.11.23
  • Published : 2015.12.12

Abstract

In order to design progressive die many processes are needed and it takes a lot of time to get a final product. In this study, we reduced design processes by using reverse engineering and studied on strip layout design which is the core part of die design. And we got a optimized strip layout design by CimatronE Die Design which is the 3D design program. In this strip layout design we obtained the more effective methode by using reverse engineering.

Keywords

References

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