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Crack-Healing Behavior of SiC with Additive SiO2 Colloid

  • Ahn, Seok-Hwan (Department of Mechatronics, Jungwon University) ;
  • Moon, Chang-Kwon (Department of Materials Science and Engineering, Pukyong National University) ;
  • Nam, Ki-Woo (Department of Materials Science and Engineering, Pukyong National University)
  • Received : 2014.09.25
  • Accepted : 2014.12.29
  • Published : 2015.02.28

Abstract

This study focuses on the crack-healing behavior and bending strength of SiC ceramics with sintering additives of $SiO_2$colloid. Optimized crack-healing condition was found to be 1hr at an atmosphere of 1373 K. The maximum crack size that can be healed at the optimized condition was a semi-elliptical surface crack of $450{\mu}m$ in diameter. After heat treatment at the optimum temperature in air, the crack morphology almost entirely disappeared and the strength recovered to the value of the smooth specimens at room temperature for the investigated crack sizes up to $450{\mu}m$. The crack with width $1.4{\mu}m$ can be completely heal the surface crack.

Keywords

References

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