References
- F. Cardarelli, 'Materials Handbook', Springer (2000) 45-57.
- V.Y. Mehr, M.R. Toroghinejad and A. Rezaejan, Mater. Sci. Eng. A, "Mechanical properties and microstructure evolutions of multilayered Al-Cu composites produced by accumulative roll bonding process and subsequent annealing", 601 (2014) 40-47. https://doi.org/10.1016/j.msea.2014.02.023
- Kim IK and Hong SI, Mater. Design, "Effect of heat treatment on the bending behavior of tri-layered Cu/Al/Cu composite plates", 47 (2013) 590-598. https://doi.org/10.1016/j.matdes.2012.12.070
- E. Hajjari, M. Divandari, S.H. Razavi, T. Homma and S. Kamado, Intermetallics, "Intermetallic compounds and antiphase domains in Al/Mg compound casting", 23 (2012) 182-186. https://doi.org/10.1016/j.intermet.2011.12.001
- M. Divandari and A.R. Vahid Golpayegani, Mater. Design, "Study on Al/Cu rich phases formed in A356 alloy by inserting Cu wire in pattern in LFC process", 30 (2009) 3279-3285. https://doi.org/10.1016/j.matdes.2009.01.008
- K.J.M. Papis, B. Hallstedt, J.F. Loffler and P.J. Uggowitzer, Acta Mater., "Interface formation in aluminium-aluminium compound casting", 56 (2008) 3036-3043. https://doi.org/10.1016/j.actamat.2008.02.042
- S.S.M. Kartheek, K.V. Vamsi, B. Ravisankar, K. Sivaprasad and S. Karthikeyan, Procedia Mater. Sci., "Microstructural and nanoindentation studies across diffusion-bonded interfaces in Al/Cu metal intermetallic laminates", 6 (2014) 709-715. https://doi.org/10.1016/j.mspro.2014.07.087
- Lee KS and Kwon YN, Trans. Nonferrous Met. Soc. China, "Solid-state bonding between Al and Cu vacuum hot pressing", 23 (2013) 341-346. https://doi.org/10.1016/S1003-6326(13)62467-X
- Kwon YD and Lee ZH, Mater. Sci. Eng. A, "The effect of grain refining and oxide inclusion on the fluidity of Al-4.5Cu- 0.6Mn and A356 alloys", 360 (2003) 372-376. https://doi.org/10.1016/S0921-5093(03)00504-5
- A. Heidarzadeh, M. Emamy, A. Rahimzadeh, R. Soufi, D. Sohrabi Baba Heidary and Sh. Naibi, J. Mater. Eng. Performance, "The effect of copper addition on the fluidity and viscosity of an Al-Mg-Si alloy", 23 (2014) 469-476. https://doi.org/10.1007/s11665-013-0794-6
- W. Prukkanon, N. Srisukhumbowornchai and C. Limmaneevichitr, J. Alloys Compd., "Influence of Sc modification on the fluidity of an A356 aluminum alloy", 487 (2009) 453-457. https://doi.org/10.1016/j.jallcom.2009.07.169
- K.R. Ravi, R.M. Pillai, K.R. Amaranathan, B.C. Pai, and M. Chakraborty, J. Alloys Compounds, "Fluidity of aluminum alloys and composites, a review", 456 (2008) 201-210. https://doi.org/10.1016/j.jallcom.2007.02.038
- O. Dezellus, M. Zhe, F. Bosselet, D. Rouby and J.C. Viala, Mater. Sci. Eng. A, "Mechanical testing of titanium/aluminiumsilicon interface: Effect of T6 heat treatment", 528 (2011) 2795-2803. https://doi.org/10.1016/j.msea.2010.12.036
- O. Dezellus, L. Milani, F. Bosselet, M. Sacerdote-Peronnet, D. Rouby and J.C. Viala, J. Mater. Sci., "Mechanical testing of titanium/aluminium- silicon interfaces by push-out", 43 (2008) 1749-1756. https://doi.org/10.1007/s10853-007-2411-2
- B.A. Huchler: Ph.D. Thesis, Univ. Birmingham, UK, "Pressure infiltration behaviour and properties of aluminium alloy - oxide ceramic preform composites", (2009).
- Y. Tanaka, M. Kajihara and Y. Watanabe, Mater. Sci. Eng. A, "Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al", 445-446 (2007) 355-363. https://doi.org/10.1016/j.msea.2006.09.047
- Kim HJ, Lee JY, Paik KW, Koh KW, Won JH, Choe SH, Lee J, Moon JT and Park YJ, IEEE Trans. Comp. Packag. Technol., "Effect of Cu/Al intermetallic compound on copper wire and aluminum pad bondability", 26 (2003) 367-374. https://doi.org/10.1109/TCAPT.2003.815121
Cited by
- Effect of Boron on Electrical and Thermal Conductivities of Aluminum vol.36, pp.5, 2016, https://doi.org/10.7777/jkfs.2016.36.5.147