Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Properties of Sputter Deposited Cr Thin Film on Polymer Substrate by Glancing Angle Deposition

폴리머 기판에 스퍼터법으로 경사 증착한 Cr박막의 특성

  • Bae, Kwang-Jin (School of Materials Science & Engineering, Pusan National University) ;
  • Choi, In-Kyun (School of Materials Science & Engineering, Pusan National University) ;
  • Jeong, Eun-Wook (School of Materials Science & Engineering, Pusan National University) ;
  • Kim, Dong-Yong (School of Materials Science & Engineering, Pusan National University) ;
  • Lee, Tae-Yong (Research & Development Division, Hyundai Motor Group) ;
  • Cho, Young-Rae (School of Materials Science & Engineering, Pusan National University)
  • 배광진 (부산대학교 재료공학부) ;
  • 최인균 (부산대학교 재료공학부) ;
  • 정은욱 (부산대학교 재료공학부) ;
  • 김동용 (부산대학교 재료공학부) ;
  • 이태용 (현대자동차 연구개발본부) ;
  • 조영래 (부산대학교 재료공학부)
  • Received : 2014.09.28
  • Accepted : 2014.12.30
  • Published : 2015.01.27
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Abstract

Glancing angle deposition (GLAD) is a powerful technique to control the morphology and microstructure of thin film prepared by physical vapor deposition. Chromium (Cr) thin films were deposited on a polymer substrate by a sputtering technique using GLAD. The change in thickness and Vickers microhardness for the samples was observed with a change in the glancing angle. The adhesion properties of the critical load (Lc) by a scratch tester for the samples were also measured with varying the glancing angle. The critical load, thickness and Vickers microhardness for the samples decreased with an increase in the glancing angle. However, the thickness of the Cr thin film prepared at a $90^{\circ}$ glancing angle showed a relatively large value of 50 % compared to that of the sample prepared at $0^{\circ}$. The results of X-ray diffraction and scanning electron microscopy demonstrated that the effect of GLAD on the microstructure of samples prepared by sputter technique was not as remarkable as the samples prepared by evaporation technique. The relatively small change in thickness and microstructure of the Cr thin film is due to the superior step-coverage properties of the sputter technique.

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References

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