참고문헌
- J. Sestak and G. Berggren, Study of the kinetics of the mechanism of solid-state reactions at increasing temperatures, Thermochim. Acta, Vol. 3, 1971, pp. 1-12. https://doi.org/10.1016/0040-6031(71)85051-7
- G. Wang, G. Jiang and J. Zhang, Preparation, curing kinetic and properties of a novel amine with flexible polyoxypropylene side chain curing agent for epoxy resin, Thermochim. Acta, Vol. 589, 2014, pp. 197-206. https://doi.org/10.1016/j.tca.2014.05.026
- T.A. Bogetti and J.W. Gillespie, Process-induced stress and deformation in thick-section thermoset composite laminates. Journal of Composite Materials, Vol. 26, 1992, pp. 626-660. https://doi.org/10.1177/002199839202600502