Applied Science and Convergence Technology

The Korean Vacuum Society (한국진공학회)
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A Study on the Thermal Oxidation and Wettability of Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-In

  • Lee, Hyunbok (Department of Polymer Science and Engineering, University of Massachusetts) ;
  • Cho, Sang Wan (Department of Physics, Yonsei University)
  • Received : 2014.10.15
  • Accepted : 2014.11.25
  • Published : 2014.11.30
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Abstract

The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin $InO_x$ layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.

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