과제정보
연구 과제 주관 기관 : 미래창조과학부
방사선산업학회지 (Journal of Radiation Industry)
- 제8권1호
- /
- Pages.43-47
- /
- 2014
- /
- 1976-2402(pISSN)
마이크로웨이브 플라즈마 처리를 통한 섬광체 패널 기판의 접촉가 특성변화
Characteristics of the Contact Angle Using the Microwave Plasma Treatment on Scintillator Panel Substrates
-
김병욱
(전북테크노파크 방사선영상기술센터)
;
-
김영주
(전북테크노파크 방사선영상기술센터)
;
-
유철우
(전북테크노파크 방사선영상기술센터)
;
-
최병정
(전북테크노파크 방사선영상기술센터)
;
- 권영만 (전북테크노파크 방사선영상기술센터) ;
- 이영춘 (전북테크노파크 방사선영상기술센터) ;
- 김명수 (한국과학기술원 원자력 및 양자공학과) ;
-
조규성
(한국과학기술원 원자력 및 양자공학과)
-
Kim, Byoungwook
(Radiation Imaging Technology Center, JBTP)
;
-
Kim, Youngju
(Radiation Imaging Technology Center, JBTP)
;
-
Ryu, Cheolwoo
(Radiation Imaging Technology Center, JBTP)
;
-
Choi, Byoungjung
(Radiation Imaging Technology Center, JBTP)
;
- Kwon, Youngman (Radiation Imaging Technology Center, JBTP) ;
- Lee, Youngchoon (Radiation Imaging Technology Center, JBTP) ;
- Kim, Myungsoo (Department of Nuclear & Quantum Engineering, KAIST) ;
-
Cho, Gyuseong
(Department of Nuclear & Quantum Engineering, KAIST)
- 투고 : 2014.04.23
- 심사 : 2014.05.29
- 발행 : 2014.05.31
초록
By measuring decrease change of the contact angle after microwave plasma treatment on the glass and Al as a scintillator panel sample substrate, the adhesive performance of scintillator panel can be expected to improve. Also resolution and sensitivity of scintillator panel after microwave plasma treatment can be expected to maintain highly.