Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Improvement of Vibration Performance for Wafer Transfer Robot using Frequency Analysis of Motion Profile

모션프로파일의 주파수분석을 통한 웨이퍼 이송로봇의 진동성능 향상

  • Shin, Dongwon (Department of Mechanical System Engineering, Kumoh National Institute of Technology) ;
  • Yun, Jang Kyu (Department of Mechanical Engineering, Kumoh National Institute of Technology)
  • 신동원 (금오공과대학교 기계시스템공학과) ;
  • 윤장규 (금오공과대학교 기계공학과)
  • Received : 2014.02.05
  • Accepted : 2014.06.16
  • Published : 2014.08.01
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Abstract

This paper is study of solving vibration problem occurred in moving hand of wafer transfer robot in semiconductor manufacturing line. Long settling time for decreasing vibration makes low production rate, and moreover the excessive vibration of hand sometimes breaks the wafer in a cassette. The ways of reducing the moving speed and changing the type of motion profile did not help for lessening vibration. Therefore, we analyzed the mechanical property of the hand such as natural frequency, and frequency component of the motion profile currently used in the manufacturing line. In several conditions of motion profile, we found the best condition of which the frequency component in near of natural frequency of the hand is minimal and this induced small vibration in moving hand. The results were verified theoretically and experimentally using frequency analysis.

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References

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